-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
American Standard Circuits Adds Orbotech Advanced PCB Solutions to Increase Quality and Production Throughput
December 17, 2015 | OrbotechEstimated reading time: 2 minutes
ORBOTECH LTD announced today that American Standard Circuits (ASC), a US-based manufacturer of complete advanced circuit board solutions, has successfully integrated Orbotech’s Paragon 9800 Laser Direct Imaging system, Sprint 120 Inkjet legend printer, and a complete Frontline InPlan and InSolver (Impedance Solver) preproduction Engineering solutions into its Chicago production facility.
The new systems are expected to significantly increase productivity and product quality at ASC’s production facility.
- The Paragon 9800 Laser Direct Imaging PCB production system delivers high throughput, accurate registration and superior image quality for ASC’s HDI, flex, rigid-flex and solder mask applications.
- The Sprint 120 Inkjet Printer increases performance, flexibility and cost savings for ASC’s PCB legend printing operations.
- The complete Engineering suite from Frontline, which supports full pre-production automation, enables ASC to develop reliable manufacturing and testing tools that communicate directly to PCB designers and manufacturing machinery, ensuring ASC total control of its processes while lowering its bottom line costs.
“Our strategy is to provide all of our customers the very best PCB products on the market today” said Anaya Vardya, ASC’s CEO. “Whether that be RF or metal backed boards, Flex and Rigid Flex boards or high density PCBs we are in the business of giving our customers the very best so that they can be the very best. On the same token we consider Orbotech to be the very best at what they do and that’s why we have purchased their solutions and extended our long term partnership with them.”
“We are confident that our best-in-class systems and solutions will make ASC’s production process even more efficient, especially when combined with the Orbotech products that are already in place” said Hadar Himmelman, President of Orbotech West.
Page 1 of 2
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.