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Socionext Acquires Package Design Firm Bayside Design Inc.January 4, 2016 | PRNewswire
Estimated reading time: 1 minute
Socionext Inc. has acquired Bayside Design Inc. (BDI), a U.S.-based supplier of package design services, through Socionext America Inc. (SNA), its U.S. subsidiary. BDI started operations as a 100% owned subsidiary of SNA on January 1, 2016.
Previously, development of SoC (System-on-Chip) design flow mainly focused on optimizing the layout of in-chip elements, such as transistors and interconnects. With the increasing demand for higher functionality and performance, it is becoming necessary to pay more attention to the chips' packages, and to the printed circuit boards (PCB) where these packages are mounted. A new methodology, Chip-Package-PCB co-design, helps companies cost-effectively meet today's performance, functionality and time-to-market requirements. This methodology is expected to become more important in the future.
BDI has extensive experience and expertise in quickly delivering high-quality package designs for high-speed, high-performance SoCs.
Socionext is providing SoC-based solutions to a variety of markets that require such high-quality SoCs, such as IT infrastructure (e.g., servers, storage systems, and networks), consumer and industrial equipment and the Internet of Things (IoT). By implementing BDI's technologies within its product design, Socionext will be able to more quickly provide high-performance, high-quality products and services to the global market.
This is part of the Socionext commitment to continually enhance the quality of its designs and to meet the challenge of new technologies, thus helping its customers deliver more valuable products and services.
About Socionext Inc.
Socionext is a new, innovative enterprise that designs, develops and delivers System-on-Chip products to customers worldwide. The company is focused on imaging, networking and other dynamic technologies that drive today's leading-edge applications. Founded in 2015, Socionext Inc. is headquartered in Yokohama, and has offices in Japan, Asia, United States and Europe to lead its product development and sales activities.
About Bayside Design Inc.
Bayside Design Inc. (BDI) was founded in 2002 to provide the most comprehensive high speed engineering design services with primary focus on High Speed Package and Board Design Services and Solutions. Majority of the customers served by BDI are leading IP providers, high end technology companies in Compute, Storage, Communication, RF, Microwave, Millimeterwave, Optical and Consumer markets.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop01/25/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.