Fresh PCB Concepts: PCB Design Essentials for Electric Vehicle Charging
Elementary, Mr. Watson: Rules of Thumb—Guidelines vs. Principles for PCB Design
Beyond Design: High-speed Rules of Thumb
Ucamco Updates Gerber File Specification
January 6, 2016 | UcamcoEstimated reading time: Less than a minute
Ucamco published revision 2016.01 of the Gerber Format Specification. This revision adds new attributes for castellated holes (or PTH on the board edge) and for tooling and break-out holes.
The specification can be obtained from the download page of www.ucamco.com free of charge.
About Ucamco
Ucamco (formerly Barco ETS) is a market leader in PCB CAM software, photoplotting and direct imaging systems, with a global network of sales and support centers. Headquartered in Ghent, Belgium, Ucamco has over 25 years of ongoing experience in developing and supporting leading-edge photoplotters and front-end tooling solutions for the global PCB industry. Key to this success is the company's uncompromising pursuit of engineering excellence in all its products. Ucamco also owns the IP rights on the Gerber File Format through its acquisition of Gerber Sytems Corp. (1998).
Share on:
Suggested Items
QinetiQ US Awarded $42M Task Order to Support U.S. Army Advanced Sensor Processing and Imaging Technologies
12/02/2024 | QinetiQQinetiQ US has been awarded a four-year, $42 million task order to support the U.S. Army Combat Capabilities Development Command (DEVCOM) C5ISR Center's Research & Technology Integration (RTI) Directorate.
Teledyne's Detector Enables NASA's Europa Clipper MISE Instrument
10/21/2024 | TeledyneTeledyne Technologies Incorporated is pleased to announce its contribution to NASA's successful Europa Clipper launch, which took place at NASA's Kennedy Space Center.
Connect the Dots: Designing for Reality—Outer Layer Imaging
09/26/2024 | Matt Stevenson -- Column: Connect the DotsWelcome to the next step in the manufacturing process—the one that gets the chemical engineer in all of us excited. I am referring to outer layer imaging, or how we convert digital designs to physical products. On a recent episode of I-Connect007’s On the Line with… podcast, we explained how the outer layer imaging process maps the design’s unique features onto the board.
Omni Design Technologies Partners with Aura Intelligent Systems on Next Generation Radar
09/16/2024 | BUSINESS WIREOmni Design Technologies, a leading provider of high-performance, low-power data acquisition and signal-processing solutions, and Aura Intelligent Systems, a developer of high-resolution imaging radar for ADAS and autonomous vehicles, announced a partnership on Aura’s next generation digital radar development.
MEMS & Imaging Sensors Summit to Highlight Innovations Driving the Next Generation of Connectivity
09/11/2024 | SEMIThe SEMI MEMS & Imaging Sensors Summit, themed Sensor Revolution for a Connected Future, is set to bring together some of the world’s leading minds in sensor technology on November 14 at the International Conference Center Munich (ICM), Germany.