Dan’s Biz Bookshelf: ‘Born to Create’
It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Marcy's Musings: Engineering Economics
Rogers Offers Practical Insights into Testing and Using Advanced Circuit Materials at DesignCon 2016
January 6, 2016 | Rogers CorporationEstimated reading time: 3 minutes
Rogers Corporation will be exhibiting and educating at the upcoming DesignCon. Now in its 21st year, DesignCon is a premiere event for design chip-circuit-and system-level engineers working on high-frequency analog and high-speed digital circuits. DesignCon 2016 is scheduled for January 19-21, 2016 (January 20-21 for the exhibition) at the Santa Clara Convention Center (Santa Clara, California).
On the conference side, John Coonrod, Technical Marketing Manager for Rogers Advanced Connectivity Solutions, and author of the popular ROG Blog series, will participate in a 75-minute panel discussion targeting effective measurement methods for high-frequency/high-speed printed-circuit-board (PCB) materials.
This technical presentation will focus, in particular, on frequencies above 10 GHz, as needed for a growing number of applications, including many emerging wireless communications systems. Conducted by the IPC D-24c task group (www.ipc.org) on High Frequency Test Methods, the round-robin-style panel discussion (“Track 05: Characterize PCB Materials and Processing”) will explore the properties of some of the latest circuit materials and examine different methods for testing and characterizing those materials. Joining John Coonrod in the discussion will be Glenn Oliver, Senior Engineer at DuPont, and Don DeGroot, President of CCN.
Also, Dr. Allen F. Horn III will be presenting “Effect of conductor profile structure on propagation in transmission lines” at 9:20 AM on Thursday, January 21 and participating as a member of the August panel discussion “Getting smooth copper and keeping it” at 3:45 PM on Thursday, January 21.
As part of the DesignCon Expo Hall, representatives from Rogers Corp. (www.rogerscorp.com) will be exhibiting at Booth #702, with information and insight on the use of their circuit materials, including ULTRALAM® 3850HT, CLTE-XT™, and RO3003™ laminates. Rogers will also be previewing their new material system developed for ultra low loss digital applications.
ULTRALAM 3850HT high-temperature (HT) liquid-crystal-polymer (LCP) circuit material delivers high yields in multilayer circuits. Its high melt temperature of +330°C improves multilayer layer-to-layer registration and offers improved thermal stability, while its low effective dielectric constant (3.14 @10GHz), low loss (0.002), and thin core offerings make it an ideal circuit material for millimeter frequencies, including 77 GHz used in long range automotive collision-avoidance radar systems. Being highly impermeable, it is an attractive alternative to ceramic for MMIC (monolithic microwave integrated circuit) packaging.
Page 1 of 2
Share on:
Suggested Items
Fresh PCB Concepts: PCB Design Essentials for Electric Vehicle Charging
11/27/2024 | Team NCAB -- Column: Fresh PCB ConceptsElectric vehicles (EVs), powered by electricity rather than fossil fuels, are transforming transportation and reducing environmental impacts. But what good is an EV if it can't be easily charged? In this month's column, Ramon Roche dives into the role of printed circuit boards (PCBs) in electric vehicle charging (EVC)—and the design considerations.
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.