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Right-sizing Silver: An Application-driven Approach to Engineering Reliability

06/24/2026 | Ebad Rehman, MacDermid Alpha Electronics Solutions
Rising cost pressure and metals market uncertainty are prompting manufacturers to rethink alloy composition to balance total cost of ownership, process yield, and mechanical performance. Solder alloy selection directly influences cost structure, process stability, and long‑term reliability in electronics assembly. As manufacturing scales and product requirements advance, these decisions are increasingly revisited with a more focused objective: aligning materials with how products are built, processed, and used in real‑world conditions.

Knocking Down the Bone Pile: The Business Case for Component Reclamation

06/23/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Electronic waste is increasing globally at an alarming rate. By 2030, it is estimated that the world will generate approximately 82 million tons of electronic waste per year. Rapid technological advances, shorter product lifecycles, and supply chain disruptions often lead manufacturers to build bloated inventories of electronic products. Unfortunately, some of this inventory ends up as electronic waste when components become obsolete or surplus to forecasted requirements, including high-value devices.

Kingboard Raises $1.5 Billion Through Kingboard Laminates Stake Sale to Support PCB Expansion

06/17/2026 | I-Connect007 Editorial Team
Kingboard Holdings has raised approximately HK$11.77 billion (US$1.5 billion) through the sale of a portion of its stake in subsidiary Kingboard Laminates Holdings, as growing demand from AI infrastructure drives investment across the PCB and electronics materials supply chain.

NUBURU Defense Unveils Italian Plan, Strengthens Strategic Team

06/17/2026 | BUSINESS WIRE
The plan is expected to be supported by senior strategic advisers Prof. Carlo Alberto Carnevale Maffè and Gen. Pietro Serino.

TSMC Accelerates CoPoS Development; Taiwan Suppliers Leverage FOPLP for Glass Core Substrates

06/17/2026 | TrendForce
The rapid growth of demand for AI semiconductors is driving the evolution of advanced packaging technologies, with Fan-Out Panel-Level Packaging (FOPLP) emerging as a new battleground across the industry.
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