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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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New DownStream Training Dates: March 2 and July 20February 3, 2016 | DownStream Technologies, LLC
Estimated reading time: Less than a minute
Get more out of your software investment. Attend training to learn all the capabilities within your DownStream BluePrint-PCB software. When you use BluePrint to its fullest potential you reap all the rewards and benefits the software has to offer.
This technical training course will focus on how to use the powerful features within BluePrint to generate documents and documents sets. Emphasis will be placed on using the Gallery and Document Templates to automate the process.
Training courses are always a good investment, in yourself and in your software. As software packages become more robust and powerful with each release, it is wise to brush up on your skills and learn the new features and functionalities that lie within the software.
Where and When
- Wednesday, March 2, Phoenix, Arizona
- Wednesday, July 20, Marlborough, Massachusetts
- Technical Training 9:00 AM-5:00 PM
For more information on this course, or to register, please click here.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop01/25/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.