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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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IPC APEX EXPO 2016 to Feature Buzz Sessions on Latest Tech TrendsFebruary 10, 2016 | IPC
Estimated reading time: 2 minutes
Tackling the hot topics that have the electronics industry “buzzing,” seven free Buzz sessions will be offered at IPC APEX EXPO, March 15-17 at the Las Vegas Convention Center. The industry’s top technical experts will provide information and insight on subjects ranging from conformal coating and lead-free solder alloys to R&D funding and a market outlook for the global electronics supply chain.
Addressing conformal coatings, session moderator Doug Pauls, Rockwell Collins, will discuss challenges and issues around application and use of this material on March 15. Later that afternoon, Ken Schramko, IPC government regulations, will moderate discussion on the National Network for Manufacturing Innovation (NNMI) and how it will leverage existing resources with industry, academia and government partners to nurture manufacturing innovation and accelerate commercialization.
On March 16, industry experts, Richard Coyle, Nokia; Karl Seelig, AIM Inc.; and Julie Silk, Keysight Technologies, will cover high reliability lead-free solder alloys and their life expectancies in assemblies. In the afternoon, IPC members are invited to attend a Town Hall Meeting to share their feedback on membership and get an update on IPC activities. Rounding out the afternoon, Randy Cherry, IPC, will provide an overview on IPC’s Validation Services and Standards Gap Analysis programs.
On March 17, Walter Custer, Custer Consulting Group, and Sharon Starr, IPC, will team up to share their latest data on global and regional market trends and provide an economic update and outlook for future growth. Rounding up the Buzz session lineup, Moderator Rick Bromm, Altex Engineered Electronic Solutions, will lead a panel of speakers as they discuss the soon-to-be-released Revision C of IPC/WHMA-620, Requirements and Acceptance for Cable and Wire Harness Assemblies. The panel will detail the importance of this standard and how wire harness process equipment companies are incorporating it into the function of their equipment.
Admission to Buzz sessions, access to exhibit hall and other networking events are free to those who register in advance, a savings of $35 on-site. In addition, attendees who register for the All-Access Package will receive a significant percentage off a la carte options. Details, including dates and times, are available here.
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Repair of soldered components is a constant necessity in the electronics industry. Product performance enhancement, damaged components, and exchange of wrong placed components are some of the motivations behind a repair. Dispensing and placing a 400 μm pitch component manually is very time consuming and could cause collateral damage to the already populated components. A novel automatic repair method and tools with no human interaction were developed. Learn about this method…
The SMTA Capital Chapter is excited to announce the upcoming SMTA Capital Chapter Expo and Tech Forum, scheduled for March 7th, 2024, at Sweeny Barn in Manassas, Virginia.
The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.
Saki’s Advanced Optical Inspection Boosts Quality Assurance at US-headquartered Smart Modular Technologies02/14/2024 | Saki Corporation
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce that it has supplied inline optical inspection systems to Smart Modular Technologies, a Newark California based manufacturer of high-performance DRAM modules and solid-state disk drives (SSDs).
Ucamco is proud to release UcamX v2023.12 and Integr8tor v2023.12. These new versions of our CAM and Pre-CAM software include plenty of additions to increase our customers’ productivity, highlighted by the topics below.