Elementary, Mr. Watson: High Power: When Physics Becomes Real
The Shaughnessy Report: Watt About Power Integrity?
Global PCB Connections: Understanding Your Fabricator’s Capabilities (or Niche)
IPC APEX EXPO 2016 to Feature Buzz Sessions on Latest Tech Trends
February 10, 2016 | IPCEstimated reading time: 2 minutes
Tackling the hot topics that have the electronics industry “buzzing,” seven free Buzz sessions will be offered at IPC APEX EXPO, March 15-17 at the Las Vegas Convention Center. The industry’s top technical experts will provide information and insight on subjects ranging from conformal coating and lead-free solder alloys to R&D funding and a market outlook for the global electronics supply chain.
Addressing conformal coatings, session moderator Doug Pauls, Rockwell Collins, will discuss challenges and issues around application and use of this material on March 15. Later that afternoon, Ken Schramko, IPC government regulations, will moderate discussion on the National Network for Manufacturing Innovation (NNMI) and how it will leverage existing resources with industry, academia and government partners to nurture manufacturing innovation and accelerate commercialization.
On March 16, industry experts, Richard Coyle, Nokia; Karl Seelig, AIM Inc.; and Julie Silk, Keysight Technologies, will cover high reliability lead-free solder alloys and their life expectancies in assemblies. In the afternoon, IPC members are invited to attend a Town Hall Meeting to share their feedback on membership and get an update on IPC activities. Rounding out the afternoon, Randy Cherry, IPC, will provide an overview on IPC’s Validation Services and Standards Gap Analysis programs.
On March 17, Walter Custer, Custer Consulting Group, and Sharon Starr, IPC, will team up to share their latest data on global and regional market trends and provide an economic update and outlook for future growth. Rounding up the Buzz session lineup, Moderator Rick Bromm, Altex Engineered Electronic Solutions, will lead a panel of speakers as they discuss the soon-to-be-released Revision C of IPC/WHMA-620, Requirements and Acceptance for Cable and Wire Harness Assemblies. The panel will detail the importance of this standard and how wire harness process equipment companies are incorporating it into the function of their equipment.
Admission to Buzz sessions, access to exhibit hall and other networking events are free to those who register in advance, a savings of $35 on-site. In addition, attendees who register for the All-Access Package will receive a significant percentage off a la carte options. Details, including dates and times, are available here.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.