Fresh PCB Concepts: PCB Design Essentials for Electric Vehicle Charging
Elementary, Mr. Watson: Rules of Thumb—Guidelines vs. Principles for PCB Design
Beyond Design: High-speed Rules of Thumb
IPC APEX EXPO 2016 to Feature Buzz Sessions on Latest Tech Trends
February 10, 2016 | IPCEstimated reading time: 2 minutes
Tackling the hot topics that have the electronics industry “buzzing,” seven free Buzz sessions will be offered at IPC APEX EXPO, March 15-17 at the Las Vegas Convention Center. The industry’s top technical experts will provide information and insight on subjects ranging from conformal coating and lead-free solder alloys to R&D funding and a market outlook for the global electronics supply chain.
Addressing conformal coatings, session moderator Doug Pauls, Rockwell Collins, will discuss challenges and issues around application and use of this material on March 15. Later that afternoon, Ken Schramko, IPC government regulations, will moderate discussion on the National Network for Manufacturing Innovation (NNMI) and how it will leverage existing resources with industry, academia and government partners to nurture manufacturing innovation and accelerate commercialization.
On March 16, industry experts, Richard Coyle, Nokia; Karl Seelig, AIM Inc.; and Julie Silk, Keysight Technologies, will cover high reliability lead-free solder alloys and their life expectancies in assemblies. In the afternoon, IPC members are invited to attend a Town Hall Meeting to share their feedback on membership and get an update on IPC activities. Rounding out the afternoon, Randy Cherry, IPC, will provide an overview on IPC’s Validation Services and Standards Gap Analysis programs.
On March 17, Walter Custer, Custer Consulting Group, and Sharon Starr, IPC, will team up to share their latest data on global and regional market trends and provide an economic update and outlook for future growth. Rounding up the Buzz session lineup, Moderator Rick Bromm, Altex Engineered Electronic Solutions, will lead a panel of speakers as they discuss the soon-to-be-released Revision C of IPC/WHMA-620, Requirements and Acceptance for Cable and Wire Harness Assemblies. The panel will detail the importance of this standard and how wire harness process equipment companies are incorporating it into the function of their equipment.
Admission to Buzz sessions, access to exhibit hall and other networking events are free to those who register in advance, a savings of $35 on-site. In addition, attendees who register for the All-Access Package will receive a significant percentage off a la carte options. Details, including dates and times, are available here.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Share on:
Suggested Items
HyRel Announces Sale of First Versacell Robotic System to Leading Defense Contractor
12/03/2024 | HyRelHyRel Technologies, a global provider of quick-turn semiconductor modification solutions, is proud to announce the sale of its first Versacell Robotic Solder Dip & BGA Reballing System to one of the top five defense contractors. Originally developed for internal use, the revolutionary Versacell System drew the attention of the contractor, who recognized its impressive precision, accuracy, and efficiency.
Nolan’s Notes: Soldering Technologies
12/03/2024 | Nolan Johnson -- Column: Nolan's NotesThere are schools of thought that soldering methods are similarly anachronistic but still useful enough not to be worth changing. While that may be true, I see that soldering technologies are experiencing significant changes. It might not be apparent on the surface, but changes are afoot, and there are some disruptive things underway as well.
SMT007 Magazine Explores Soldering Technologies—December 2024
12/02/2024 | I-Connect007 Editorial TeamSoldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/29/2024 | Nolan Johnson, I-Connect007If you’re in the U.S. today, odds are you’re at home enjoying the aftermath of a Thanksgiving holiday meal. Let me just say that whether you had a Thanksgiving holiday surrounded by family, friends, or both, I hope it was joyous. If you know someone who doesn’t have friends or family with whom to share this time, please reach out and include them. Chronic loneliness can exact a measurable toll on our mental and physical health. Wherever you are on the globe this holiday season, I encourage you to reach out to someone who might be battling loneliness and connect. It will make a difference to them. Not only will it help get you in the mood for your winter holiday of choice, but it’ll be good for your mental health as well.
Koh Young Technology Showcasing Advanced Packaging Inspection Solutions at SEMICON Japan at Tokyo Big Sight
11/26/2024 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions in Hall 1 Booth 1310 at Tokyo Big Sight on December 12-13, 2024.