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A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
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Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
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Cadence’s OrCAD Capture Supports Intel Schematic Connectivity Format
February 17, 2016 | Cadence Design Systems, Inc.Estimated reading time: 1 minute

Cadence Design Systems’ OrCAD Capture now provides export capability for Intel Schematic Connectivity Format (ISCF), targeted at automating Intel-based design reviews. ISCF was developed by Intel to streamline the collaboration process with its customers. Intel worked with Cadence to develop a direct ISCF generation capability in OrCAD Capture to make this collaboration process simpler and more efficient. Customers requiring a review with Intel's Customer Solutions Team in its Sales and Marketing Group (SMG) can now exchange design data in an Intel-approved format, optimizing the design review process.
By enabling the user to directly export hierarchical schematic designs in ISCF, OrCAD Capture improves upon the traditional method, which required Intel engineers to manually migrate the schematics. Customers can benefit from having their designs reviewed against specific guidelines early in the design cycle. They can then address issues sooner in the process, improving time to market.
"We review many schematics in OrCAD Capture/CIS format," said Rui Wang, vice president and general manager of the Technical Enablement Group in Intel's Sales and Marketing Group. "We expect this export capability from Cadence tools will significantly improve our efficiency and our customers' time to market."
"By integrating OrCAD Capture with ISCF, we are able to enable designers of IoT, wearable and mobile applications to receive faster Intel design reviews, reducing risk and cost and speeding time to market," said Steve Durrill, senior product engineering group director of the PCB Group at Cadence. "Many of Intel's growing customer base are already using our tools, and they can now leverage ISCF export to streamline their process of bringing innovative products to market."
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
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