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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Cadence’s OrCAD Capture Supports Intel Schematic Connectivity Format
February 17, 2016 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes
Cadence Design Systems’ OrCAD Capture now provides export capability for Intel Schematic Connectivity Format (ISCF), targeted at automating Intel-based design reviews. ISCF was developed by Intel to streamline the collaboration process with its customers. Intel worked with Cadence to develop a direct ISCF generation capability in OrCAD Capture to make this collaboration process simpler and more efficient. Customers requiring a review with Intel's Customer Solutions Team in its Sales and Marketing Group (SMG) can now exchange design data in an Intel-approved format, optimizing the design review process.
By enabling the user to directly export hierarchical schematic designs in ISCF, OrCAD Capture improves upon the traditional method, which required Intel engineers to manually migrate the schematics. Customers can benefit from having their designs reviewed against specific guidelines early in the design cycle. They can then address issues sooner in the process, improving time to market.
"We review many schematics in OrCAD Capture/CIS format," said Rui Wang, vice president and general manager of the Technical Enablement Group in Intel's Sales and Marketing Group. "We expect this export capability from Cadence tools will significantly improve our efficiency and our customers' time to market."
"By integrating OrCAD Capture with ISCF, we are able to enable designers of IoT, wearable and mobile applications to receive faster Intel design reviews, reducing risk and cost and speeding time to market," said Steve Durrill, senior product engineering group director of the PCB Group at Cadence. "Many of Intel's growing customer base are already using our tools, and they can now leverage ISCF export to streamline their process of bringing innovative products to market."
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
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Julia McCaffrey - NCAB GroupSuggested Items
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Macnica ATD Europe Acquires Indesmatech to Deepen Engineering Presence Across Northern Europe
05/11/2026 | BUSINESS WIREMacnica ATD Europe announced the acquisition of Indesmatech, a pan-European technology and advisory company specializing in advanced semiconductor representation, design-in support and consulting, as well as point click buying services.
Dragonfly Energy Secures Additional Nevada Tech Hub Funding
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Designing Without a Rulebook: When Engineering Becomes Innovation
05/05/2026 | Stephen V. Chavez, Siemens EDAWhat if the very rules that made you successful as a PCB designer are the ones now holding you back? This reminds me of walking the floor and attending sessions at both PCB West 2025 and APEX EXPO 2026, where one common theme stood out: More designs with traditional PCB “best practices” simply don’t apply. It’s not because they’re wrong, but because the problems we’re solving have fundamentally changed. In some cases, those best practices can actually limit performance. This is where PCB design moves beyond optimization and into something far more challenging: designing without a rulebook.
Custom LIDAR Optics Support Mission-Critical Performance
05/05/2026 | PRNewswireMeller Optics, Inc. has introduced custom fabricated LIDAR optics that can be engineered for specific UV to IR transmission requirements featured in airborne, ground, and maritime defense systems.