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Summary
There are many techniques that have been used in consumer type of products for miniaturization. These are now migrating into infrastructure and industrial products as increasing functional density is still a driving factor in the design of products. Miniaturization in component size, finer pitches, stacked packages, and closer component spacing is capable of being used as long as the challenges are understood and can be addressed for a particular project. The trend will continue to create more density on the PCBA and further desire to utilize miniaturization technologies. Another key are not covered in this paper would be test and inspection technologies.
References
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Editor's Note: This paper has been published in the technical proceedings of IPC APEX EXPO.
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