Connect the Dots: Proactive Controlled Impedance
Beyond Design: Radiation and Interference Coupling
Elementary, Mr. Watson: Design Data Packages—Circle of Concern or Circle of Influence?
Insulectro Brings Power Chats to Booth at IPC APEX EXPO 2016
March 14, 2016 | InsulectroEstimated reading time: 4 minutes
TUESDAY, MARCH 15
10:30 am Printed Electronics 101
Want to learn about Printed Electronics? Give us 13.5 minutes.
Chris Hunrath, Insulectro
11:30 am Tune into High Frequency with Tachyon 100G
Isola’s process friendly low loss, high reliability laminate system.
Norm Berry, Insulectro
1:30 pm Pyralux HT Can Take the Heat
Highest temperature PCB material system available @ 225°C
Glenn Oliver, DuPont & Michelle Walsh
2:00 pm Work Out Your Core with Interra™ FL
Fine lines and low loss layers with high copper adhesion
Glenn Oliver, DuPont & Chris Hunrath, Insulectro
3:00 pm Challenged by High Temperature Lamination?
Take the pressure off with Thermolam™
Combination high temperature conformal and release up to 315°C
Peter Decaneas, Pacothane & Chris Hunrath, Insulectro
3:30 pm Better Bonds, better Profiles, Don’t Let Your Design Get Foiled
Copper foil bond enhancements from Oak Mitsui
John Blaber, Oak-Mitsui & Joe Bevan, Insulectro
WEDNESDAY, MARCH 16
10:30 am Jump on Board and Catch the Design Wave
All about Ormet interconnects.
James Haley, EMD Performance Materials & Chris Hunrath, Insulectro
11:00 am Get Stuck on GliCap
Shikoku’s non-etching innerlayer bonding process
Koji Saeki, Shikoku & Mike Gemanis, Insulectro
1:30 pm Challenged by High Temperature Lamination?
Take the pressure off with Thermolam™
Combination high temperature conformal and release up to 315°C
Peter Decaneas, Pacothane & Chris Hunrath, Insulectro
2:00 pm Tune into High Frequency with Tachyon 100G
Isola’s process friendly low loss, high reliability laminate system.
Norm Berry, Insulectro
2:30 pm Get Out of the Rough and Ditch Pumice Scrub with Glibrite
Shikoku’s copper adhesion process for dry film and soldermask.
Koji Saeki, Shikoku & Chris Hunrath, Insulectro
3:00 pm Focus In on High Yield Imaging Processes
Photoresist matched process chemistries by Focus Tech
Scott Campbell, Focus Tech & Michelle Walsh, Insulectro
3:30 pm Wet Lam to the Rescue on VLP Copper
Process for high yields on fine line innerlayers with VLP copper
William Wilson, DuPont & Mike Gemanis, Insulectro
4:00 pm Pyralux HT Can Take the Heat
Highest temperature PCB material system available @ 225°C
Glenn Oliver, DuPont & Michelle Walsh, Insulectro
THURSDAY, MARCH 17
10:30 am Printed Electronics 101
Want to learn about Printed Electronics? Give us 13.5 minutes.
Chris Hunrath, Insulectro
11:30 am Work Out Your Core with Interra™ FL
Fine lines and low loss layers with high copper adhesion
Glenn Oliver, DuPont & Chris Hunrath, Insulectro
All Power Chats are in Space 534 at IPC APEX EXPO. No sign-up required. For further information, please phone 949-587-3326.
About Insulectro
Insulectro is the leading supplier of PCB and Printed Electronics materials used to manufacture circuit boards. Insulectro combines its premier product offering with local inventory in strategic stocking locations across the country, fabrication capabilities and backed up by expert customer and technical support services.
Insulectro supplies advanced engineered materials manufactured by DuPont®, Isola, LCOA®, CAC, Inc., Pacothane, Oak-Mitsui, Focus Tech, Shikoku, Kodak, and Coveme. These products are used by our customers to fabricate complex, multilayer circuit boards. Insulectro serves a broad customer base manufacturing rigid, rigid/flex and flexible circuit boards and printed electronics for applications in a variety of end markets including telecom, data communications, high speed computing, mobile devices, military, and medical.
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