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FCT Develops Versatile Water Soluble Flux for Leaded and Lead-Free Soldering
March 30, 2016 | FCT AssemblyEstimated reading time: Less than a minute
FCT Assembly, a developer and manufacturer of high performance solders and advanced fluxes, has formulated a unique halogen-free water soluble flux with high activity and neutral pH. FCT’s 159HF is a highly versatile solder flux formulated to perform under high temperatures and is compatible with both leaded and lead free alloys.
With the low solids content of 159HF, the water soluble flux is applicable in selective; drop-jet spray soldering applications while also being ideal for wave soldering. Because the flux stays active under critical temperatures during pre-heat and wave, 159HF performs exceptionally well in high temperature applications, especially with manufacturers using multilayer boards with lots of heat sink resulting in improved topside fill.
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Step Stencil Technologies and Their Effect on the SMT Printing Process
12/21/2017 | Greg Smith and Bill Kunkle, BlueRing Stencils, and Tony Lentz, FCT AssemblyComponents such as quad flat no lead (QFNs), land grid array (LGAs), micro ball grid array (micro BGAs), 0201s and even 01005s continue to push manufacturers to use thinner stencil foils to apply the correct volume of paste onto their boards, but larger components such as edge connectors still require larger paste volumes.
December Issue of SMT Magazine Available Now
12/04/2017 | I-Connect007The solder paste printing process accounts for almost 70% of PCB assembly defects. The December 2017 issue of SMT Magazine, which is available now, looks into the critical factors causing these challenges, and features strategies, tips and tricks, to help assemblers improve the yield and quality in the solder paste printing operation.