-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Mentor Graphics Releases Newest HyperLynx
April 4, 2016 | PRNewswireEstimated reading time: 5 minutes
Simulating every detail of a PCB's signal routing and power delivery is overwhelming. Tuning raw simulation capabilities to the specific requirements of standard interfaces and protocols (like DDRx memory and 100-Gb/s Ethernet SERDES) eases the user's burden and provides streamlined, summary pass/fail judgment on entire interfaces. The HyperLynx wizard for DDRx memory interfaces pioneered easy setup, automated whole-bus simulation, and consolidated results reporting – and is now extended to DDR4 and LPDDR4 interfaces. HTML-based reporting allows creation of design documentation and internal Web-based "publication" of results.
In the SERDES arena, protocols that support Channel Operating Margin (COM) allow checking the quality of links based on a specific, complex set of simulation steps for a single pass/fail number per-channel. The new HyperLynx tool offers the industry's first robust commercial implementation of COM for 100GbE signaling, with simulation details fully automated.
Staying true to its heritage of ease-of-use and fast interactive analysis, this more robust HyperLynx version can efficiently handle very large layouts (including extra-deep stack-ups, huge net counts, and entire multi-board systems); multi-processor and other simulation-engine performance enhancements; and caching and re-use of extracted models.
Leveraging Tools, Process and Education
In addition to improving products, Mentor is empowering engineers to tackle emerging challenges through a global educational workshop series partnering with industry expert Eric Bogatin. The series will address new high-speed technologies, as well as best-in-class methodologies, tools and processes to effectively adopt the technologies.
"At 28 Gbps and above, everything matters, and engineers must understand the essential signal integrity principles that connect physical design with electrical performance in the very high speed regime. To meet the demands of next-generation products, the successful engineer must accelerate up the learning curve," stated Dr. Eric Bogatin, adjunct professor at ECEE, University of Colorado, Boulder, and director of the Teledyne LeCroy Front Range Signal Integrity Lab. "One of the most effective ways of learning and understanding the essential design principles is through exploring virtual prototypes using simulation tools like Mentor Graphics HyperLynx with its very low learning curve."
About Mentor Graphics
Mentor Graphics Corporation is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world's most successful electronic, semiconductor and systems companies. Established in 1981, the company reported revenues in the last fiscal year of approximately $1.18 billion. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777.
Page 2 of 2Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.