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IPC-2581 Consortium Member Fujitsu Successfully Fabricates Multi-Layer PCB from IPC-2581B Design FileApril 5, 2016 | IPC
Estimated reading time: 1 minute
The electronics industry has never settled on a single approach for moving printed board design data to manufacturing. With the release of IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology, design engineers now have a way to organize and convey printed circuit board designs from CAD tools in a single intelligent file to manufacturing for fabrication, assembly and test.
At Design Forum at IPC APEX EXPO, this newest release was applied to a real-world scenario, when founding IPC-2581 Consortium member company, Fujitsu Network Communications, Inc., unveiled a 20-layer complex board manufactured only using an IPC-2581B design file.
“IPC-2581B uses an intelligent XML schema format that accelerates printed circuit board fabrication, assembly and testing, and enables design data to be transferred between engineering and manufacturing without the need for human interpretation,” said Tsuyoshi Ueshima, Senior Vice President of Development at Fujitsu Network Communications, Inc. “This eliminates redundant labor and reduces the opportunity for error, resulting in high quality products that customers expect.”
For more information on IPC-2581B or the IPC-2581B Consortium, click here.
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Europlacer has signed a global partnership agreement with Siemens, provider of the industry’s leading electronics manufacturing software solutions, to integrate Valor Process Preparation software into its Surface Mount assembly platforms and products worldwide.
Altus Group, a leading supplier of capital equipment for the electronics industry in the UK and Ireland, has added to their product line-up with MagicRay’s latest innovation in inspection, the V320 THT Pre-Reflow AOI system.
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status.
During DesignCon, I met with Amir Roy, vice president of business development for Imagineering. Amir discussed the company’s high-reliability manufacturing and focus on listening to the needs of their customers. Business is booming and Imagineering is adding new lines to increase capacity.
Bittele Electronics, a leading provider of prototype and small-to-mid volume PCB assembly services, announces the expansion of its Markham assembly facility. The strategic move aims to improve inventory accuracy and streamline operations for valued customers.