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Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
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Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Read the DesignCon Award-Winning Paper by Mentor Graphics and Wild River Technology
May 18, 2016 | Mentor GraphicsEstimated reading time: Less than a minute

This paper, "BER- and COM-Way of Channel-Compliance Evaluation: What Are the Sources of Differences?" won the DesignCon 2016 Best Paper Award. It analyzes the computational procedure specified for Channel Operation Margin (COM) and compares it to traditional statistical eye/BER analysis.
The paper was written by Vladimir Dmitriev-Zdorov, Chuck Ferry, and Christian Filip of Mentor Graphics, and Alfred P. Neves of Wild River Technology. To read this paper, click here.
Suggested Items
SEL Receives Purdue Senior Design Partner of the Year Award
05/01/2025 | Schweitzer Engineering LaboratoriesSchweitzer Engineering Laboratories (SEL) has been awarded the Senior Design Partner of the Year Award from the Edwardson School of Industrial Engineering at Purdue University.
A Look Into the Future With Futurist Kevin Surace
04/07/2025 | Barry Matties, I-Connect007In this interview after his keynote address at IPC APEX EXPO 2025, futurist Kevin Surace reflects on important lessons learned and how they shaped his own future. He also makes some bold predictions for the use of AI in PCB board design, fabrication, and assembly—and what the common household will look like in 10 years. It’s an exciting and adventurous step into a future where humans work alongside robots, all for the betterment of everyone.
Networking and Growth: Highlights from the IPC Emerging Engineer Reception
03/19/2025 | Marcy LaRont, I-Connect007It was my first day in Anaheim for IPC APEX EXPO, and I arrived at John Wayne airport on Saturday to cool and sunny weather, which, coming from Arizona, is my favorite. The show starts with technical and standards work over the weekend as we prep for the show floor opening in the days to come. Exhibitors and union workers get busy building the impressive booths that make up the exhibition, which started on Tuesday and saw a steady flow of attendees all day long.
Mind Meld: Brian Chislea and AJ Arriaga Share Their Fascinating Experience in IPC's Mentorship Program
01/28/2025 | Michelle Te, IPC CommunityIPC’s Emerging Engineer program provides professionals an opportunity early in their careers to learn from dedicated industry volunteers participating in standards development. Two participants in the program—Brian Chislea, Dow Chemical, mentor to AJ Arriaga, Summit Interconnect—share their experiences in the program in a series of articles. We will follow them through their three years in the mentorship. This is the first in the series.
'Qualcomm AI Program for Innovators' Launched to Foster On-Device AI Innovation in the Asia-Pacific Region
12/27/2024 | Qualcomm Technologies, Inc.Qualcomm Technologies, Inc. announced the launch of the Qualcomm AI Program for Innovators (QAIPI) 2025 - APAC, a new initiative aimed at supporting professional developers and startups from Japan, Singapore, and South Korea to create cutting-edge on-device AI solutions across diverse sectors.