-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Cadence Paper: Automating Inter-Layer In-Design Checks in Rigid-Flex PCBs
May 25, 2016 | Ed Hickey, Cadence Design SystemsEstimated reading time: 10 minutes
New In-Design Inter-Layer Checks Prevent Frustrating Iterations
For today’s flex and rigid-flex designs, PCB designers need to be able to perform comprehensive in-design interlayer checks of the non-conducive layers in rigid-flex PCBs, shortening the design cycle by minimizing ECAD/MCAD iterations and lowering overall end-product costs. Errors should be flagged as soon as they are created, following a correct-by-construction methodology that helps designers avoid excessive iterations and expensive respins. An actual view of what is being built can allow designers to visualize their layout stack-up based on zones. With an accurate picture, designers can perform more accurate DRCs, receive better feedback, and provide better data to the MCAD tool for fabrication (Figure 5).
Since there are many different materials and different rules a PCB designer needs to deal with, enabling and specifying rules for the combination of layers should be intuitive and easy. A simple step-by-step process (Figure 6) involves:
- Selecting the layer by choosing the desired checkbox in the layer matrix
- Selecting the rule
- Setting the value
- Defining a label that means something to the designer
- Setting the DRC display layer
- Adding a description for the rule (rules should be preserved in the tool)
Users should be able to run inter-layer checks online or offline and in batch mode. When running the checks online, the user simply sets the rules and should be able to run the DRC and view DRC results.
Most EDA tools have long supported rigid-flex PCB designs. Ideally, the latest versions of these tools need to address new challenges stemming from multiple board layers, while providing a wide breadth and depth of in-design checks covering more than 30 new native flex and surface finishes layers (Figures 7 and 8). Users should also be able to incorporate their own layers for the tool to check, so they don’t have to wait for tool updates.
Cadence’s Allegro® 17.2 PCB design portfolio automates inter-layer, in-design checks in rigid-flex PCBs, providing the capabilities discussed in this section. By allowing you to perform DRCs for various non-electrical flex layers, the tool helps to save time and avoid respins. The tool also supports real-time concurrent team design, so multiple PCB designers can work on the same PCB design database.
How much time a PCB designer can save using the rigid-flex design capability versus performing manual DRCs (and going through iterations with the fabricator) is proportional to the complexity of the design. Aside from time savings, another benefit from using the capability is the ability to prevent omissions or other errors that could impact PCB design quality and overall cost. After all, problems that are discovered by the fabricator will naturally be more costly and time consuming to resolve due to the rework and iterations needed.
Page 3 of 4
Suggested Items
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.