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Off Like a Rocket: A Review of the EIPC Summer Conference, Part 1

06/14/2024 | Pete Starkey, I-Connect007
Motorway traffic jams, airport car parking, walking for miles, queuing for security, delayed flights—oh, the joys of travelling. I was quickly reminded of my status as a foreigner while waiting patiently in line for a half-hour at passport control to enter the European Union at Amsterdam Schiphol, having flown all the way from London Luton in the United Kingdom, that great distance of 200 miles. 

Revolutionizing PCB Prototyping With ML and AM

06/14/2024 | Nick Geddes, Nano Dimension
Historically, PCB prototyping has been a meticulous and time-consuming process, often laden with complexities and high costs. Traditional methods have typically involved intricate design iterations, extensive manual labor, and significant material waste. However, the advent of AM has revolutionized this landscape, offering a rapid, cost-effective alternative that significantly accelerates the development cycle.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/14/2024 | Nolan Johnson, PCB007
This week’s must-reads are comprised of news which moves the industry forward. We’ve had quite a lot of news on a global scale, and they’re all good reads. To winnow down to just five, I chose either new information or interesting takes on ongoing industry stories. To that end, we have news about new capital equipment for advanced packaging, discussions of material selection and the imaging process during PCB fabrication, a columnist's ode to the best engineer she knows, and some optimistic news from the semiconductor industry.

Siemens Collaborates with Samsung Foundry to Expand 3D-IC Enablement Tools

06/14/2024 | Siemens
Siemens Digital Industries Software today announced that, in collaboration with Samsung Foundry, they have developed compelling new capabilities for the manufacture of multi-die packaged designs at advanced nodes and achieved a host of new product certifications for many of Siemens’ industry-leading IC design and verification technologies.

Cadence, Samsung Foundry Accelerate Chip Innovation for Advanced AI and 3D-IC Applications

06/13/2024 | Cadence Design Systems
Cadence Design Systems, Inc. announced a broad collaboration with Samsung Foundry that includes technology advancements to accelerate design for AI and 3D-IC semiconductors, including on Samsung Foundry’s most advanced gate-all-around (GAA) nodes. Cadence Design Systems, Inc. announced a broad collaboration with Samsung Foundry that includes technology advancements to accelerate design for AI and 3D-IC semiconductors, including on Samsung Foundry’s most advanced gate-all-around (GAA) nodes.
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