Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Kardinal Microsystems Joins Zuken USA Startup Partner Program
August 18, 2016 | ZukenEstimated reading time: 1 minute
Kardinal Microsystems has joined Zuken USA’s Startup Partner Program aimed at early to mid-stage companies developing electronic-based products. The new program provides access to state-of-the-art PCB and IC packaging development tools, with special terms designed to accommodate the development needs of an early-stage company.
Based in Burlington, Vermont, Kardinal Microsystems was founded in 2015 to develop a superior solution platform for IoT applications. Pascal Nsame, CEO and Founder, said: “We have extremely ambitious goals that require state-of-the-art design solutions and a partner with a proven history of technological innovation. Zuken USA has the technology we need; particularly in the area of chip/package/board co-design. This partnership is essential for our business to succeed.”
Kardinal Microsystems has developed “the smallest, fastest, smartest, most efficient IoT data platform solution available in the industry at the device level”.
Kent McLeroth, President and CEO of Zuken USA, said: “We are committed to working with early and mid-stage companies, such as Kardinal Microsystems. Our Startup Partner Program enabled us to work with Pascal and Kardinal Microsystems as a founding partner to develop a program that would provide them access to Zuken’s CR-8000 development platform while still meeting their startup needs. Helping early stage companies achieve big things is a win-win for everyone.”
Kardinal Microsystems worked closely with Zuken USA on the structure of and terms of the Startup Partner Program, offering insight into the incubation and acceleration phases of early product prototype development.
As part of the program Zuken USA offers CR-8000, the industry’s only 3D, product-centric design solution that offers architecture design, concurrent 3D multi-board support, ECAD/MCAD co-design and chip/package/board co-design. This is followed by training and deployment assistance.
Early-stage companies can request more information about Zuken USA’s Startup Partner Program, click here.
About Kardinal Microsystems
Kardinal designs, develops, manufactures and markets innovative technology platform solutions for IoT applications.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/09/2025 | Andy Shaughnessy, Design007 MagazineTrade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one. It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.
Imec Coordinates EU Chips Design Platform
05/09/2025 | ImecA consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.