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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Better to Light a Candle
Column from: Marc Carter
Marc Carter has worked in the electronics interconnection industry since 1984 in a variety of roles in fabrication and assembly materials, processes, environmental compliance, and supply chain management activities around the world. He has had the honor and privilege of working with and learning from many of the true giants of this industry in multiple functions over many years. His experience includes a major mil-aero OEM, field and development work at materials suppliers to the printed circuit industry, and an educational stint as the sole proprietor of a manufacturer’s agency representing multiple high-tech milaero material suppliers.