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Powering the Future
Column from: Brian Buyea
Brian Buyea, president of Remtec Inc. Holds a B.S. in Electrical Engineering Technology from the State University of New York at Utica/Rome. With more than 30 years of experience in PCB and ceramic circuit manufacturing and engineering, Brian has held key roles at TMT Technologies, Knowles Precision Devices, Anaren, and Dielectric Labs. Brian’s leadership is grounded in the core values of character, integrity, self discipline, teamwork, and humility.
May 20, 2026
Powering the Future: Why True Ceramic Circuits Are Not Just ‘Better PCBs’
There’s a dangerous misconception among engineers who still think ceramic circuits are just a little tougher version of a PCB, a little better at handling heat, and a premium option when FR-4 starts to struggle. That thinking will cost you performance and reliability; in some applications, it may cost you the entire design. Remtec builds are not “better PCBs,” but fundamentally different platforms. Here are eight “truths” to demonstrate that difference.April 15, 2026
Powering the Future: Why Thermal Management Defines the Future of Electronics
Every leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.March 11, 2026
Powering the Future: How Packaging Choices Make or Break Performance
When we talk about reliability in electronics, we often focus on the system level: redundancy, fail-safes, or software resilience. But long before the system is assembled or even tested, reliability is considered in materials, metallization, and the packaging process itself. If the foundation isn’t built to survive the environment, no amount of clever design downstream will make up for it.February 11, 2026
Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
Ceramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.January 14, 2026
Powering the Future: The Materials That Make Tomorrow Possible
At Remtec, we live in the intersection where science meets manufacturability, and where reliability isn’t a promise but a measurable outcome. “Powering the Future” isn’t just a slogan. It’s the challenge we face daily as engineers designing metallized ceramic substrates, power packages, and thermal solutions that quietly enable the technologies shaping our world.
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