The Chemical Connection: Common Misconceptions in Wet Processing
It’s Only Common Sense: Selling to Engineers
American Made Advocacy: America, It’s Time to Reclaim Manufacturing Leadership
3D Printed Electronics for Printed Circuit Structures
October 4, 2017 | Samuel LeBlanc, Paul Deffenbaugh, Jacob Denkins, and Kenneth Church nSCRYPT INC.Estimated reading time: 1 minute
Abstract
Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is one of the enabling factors for roll-to-roll processes. Printed electronics is improving in performance and has many applications that compete directly with printed circuit boards. The advantage of roll-to-roll is the speed of manufacturing, the large areas possible, and a reduction in costs.
As this technology continues to mature, it is also merging with the high-profile 3D printing. 3D printing is becoming more than just a rapid prototyping tool and more than just printing small plastic toys. Companies are embracing 3D printing as a manufacturing approach to fabricate complex parts that cannot be done using traditional manufacturing techniques. The combination of 3D printing and printed electronics has the potential to make novel products and, more specifically, to make objects electrically functional. Electrically functional objects have the advantage of competing with printed circuit boards.
Printed circuit structures will be a new approach to electronic packaging. It is the desire of many companies to reduce assembly processes, decrease the size of the electronics, and do this at a reduced cost. This is challenging, but the potential of printing the structure and the electronics as a single monolithic unit has many advantages. This will reduce the human touch in assembly, as the electronics and the object are printed. This will increase the ruggedness of the product, as it is a monolithic device.
This will eliminate wires, solder, and connectors, making the device smaller. This has the potential to be the future of printed circuit boards and microelectronic packaging. This article will show working demonstrations of printed circuit structures, the obstacles, and the potential future of 3D printed electronics.
To read the full version of this article which appeared in the September 2017 issue of The PCB Magazine, click here.
Share on:
Suggested Items
KOKI Expands U.S. Sales Coverage with Multiple New Representatives
04/29/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce the expansion of its U.S. sales network with the addition of three new manufacturers’ representative firms: Assembled Product Specialists, Diversitech Reps Inc., and Eagle Electronics.
INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b
04/28/2025 | iNEMIIn 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.
KYZEN to Feature Stencil Cleaning and Aqueous Cleaners at SMTA Capital Expo and Tech Form
04/28/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Capital Expo and Tech Forum, scheduled to take place Thursday, May 8 at George Mason University – Mason Square in Arlington, VA.
KYZEN Focuses on Aqueous Cleaning and Stencil Cleaning at SMTA Wisconsin
04/24/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Wisconsin Expo and Tech Forum, scheduled to take place Tuesday, May 6 at the Crowne Plaza Milwaukee Airport. KYZEN will be on-site to provide attendees with information about aqueous cleaning chemistry AQUANOX A4618 and stencil cleaner KYZEN E5631J.
SMTA Bridging the Skills Gap in Arizona
04/24/2025 | Marcy LaRont, I-Connect007One area where SMTA really excels is through its local chapters. On April 16, 2025, I-Connect007's Marcy LaRont attended the Workforce Breakfast during the SMTA Arizona Expo & Tech Forum in Mesa, which featured more than 50 electronics professionals from the local area, including defense OEMs, and others who were attending for the first time. Blackfox and Hyrel Technologies sponsored the event. The keynote presentation featured Sean Denny, a professor at Estrella Mountain Community College, who emphasized a clear need for skilled hand soldering technicians.