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I-Connect007 Magazine: APEX EXPO 2026 Preview Plus AI Tools Designers Are Watching

02/17/2026 | I-Connect007 Editorial Team
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.

Cadence Launches ChipStack AI Super Agent for Next-Gen Chip Design

02/16/2026 | Cadence Design Systems
Cadence announced a transformative step forward in redefining how semiconductors are designed with the launch of the ChipStack™ AI Super Agent—an agentic AI solution for front-end silicon design and verification.

American Standard Circuits Manufactures IC Substrate Designs Featuring 5–7 Stacked Microvias

02/13/2026 | American Standard Circuits
American Standard Circuits (ASC), a leading U.S. manufacturer of advanced printed circuit board solutions, has successfully manufactured and shipped multiple IC substrate designs incorporating 5 to 7 stacked microvias using the company’s advanced Ultra High Density Interconnect (UHDI) manufacturing platform.

Astera Labs Opens Israel Design Center to Boost AI Connectivity Expansion

02/13/2026 | Astera Labs, Inc.
Astera Labs, Inc., a leader in semiconductor-based connectivity solutions for rack-scale AI infrastructure, announced a significant expansion of its global engineering operations with the establishment of an advanced research and development center in Israel.

EIPC Winter Conference Review: From Innovation to Qualification

02/13/2026 | Pete Starkey, I-Connect007
Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”
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