-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
Designing Proper Work-Life Balance
In this issue, we hear from designers, marketers, and business owners on how they apply their professional skills to their personal lives to build a healthier work-life balance.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Why Does the PCB Industry Still Use Gerber?
November 7, 2019 | Karel Tavernier, UcamcoEstimated reading time: 2 minutes
Every so often, I hear technologists ask why so many PCB designers still use Gerber. That is a fair question. Ucamco has over 35 years of experience in developing and supporting cutting-edge software and hardware solutions for the global PCB industry. Our customers—small, medium, and large PCB fabricators—include the electronics industry’s leading companies, and many of them have been with us for over 30 years. We are dedicated to our industry and excellence in everything we do, which includes our custodianship of the Gerber format.
Data Intelligence
With us, the Gerber format has undergone a significant evolution in the past 10 years, and a near revolution in the past five years alone. Like the previous Extended Gerber (X1) format, today’s Gerber X2 is simple, easy to use, and freely available to our industry, but simple and free doesn’t mean dumb—far from it. Thanks to the use of cleverly designed attributes, Gerber X2 is an intelligent format that can do all of the things that some critics say it can’t. Gerber X2 can differentiate between pins, vias, and traces, and anyone who cares to read section 5.6 of the Gerber X2 specification will see that it does so in more detail and with greater precision than the ODB++ and IPC-2581 formats.
The industry’s professionals know this because we talk with our customers daily and listen very carefully to what they tell us about being at the electronics production coalface. What they tell us is confirmed by a quick glance at the industry’s use of the different formats. IPC-2581 is used for a negligible fraction of the world’s fabrication data sets, ODB++ is used for 5%, Gerber X2 is used for 10%, and the rest—the vast majority—uses the traditional Gerber X1 format.
Supporters of ODB++ and IPC-2581 point to the “intelligence” of these PCB data formats, but Gerber X2 is the global PCB industry’s most popular intelligent PCB data format. Sure, these formats are more intelligent than the old Gerber X1, which can’t differentiate between SMD and BGA pins. But when ODB++ was launched, it did not contain any component information either.
Figure 1 shows an apples-to-apples comparison of ODB++, IPC-2581, and Gerber X2. These screenshots from the Reference Gerber Viewer illustrate the level of information carried in a current Gerber X2 file. The pad selected on the left is identified as a via pad, and the pad selected on the right is identified as a copper-defined SMD pad, and as pin 1 of R13 with net /IRQ-7. With Gerber X2, a designer can easily distinguish between a pin, via, and trace.
To read this entire article, which appeared in the September 2019 issue of Design007 Magazine, click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
02/11/2026 | Brian Buyea -- Column: Powering the FutureCeramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.
Fresh PCB Concepts: Cost Stability in a Period of Copper and Gold Volatility
02/12/2026 | Team NCAB -- Column: Fresh PCB ConceptsAnyone who works with PCBs in any capacity right now can feel that copper and laminate prices are not stagnant, gold price is increasing even faster, and the impact shows up quickly on PCB quotations. For many design teams, this feels like a force outside their control. Raw materials go up, and the board cost goes with it. I want to highlight that many of these swings are manageable.
Connect the Dots: The Future of Designing for Reality—Pattern Plating
02/05/2026 | Matt Stevenson -- Column: Connect the DotsLast month, I discussed the outer-layer imaging process and offered tips for designers to help ensure smooth manufacturing and high-quality output. The next step in the manufacturing process is copper pattern plating, where fabrication can be tricky, and design precision is even more important. The board is now ready to have the copper traces, through-holes, vias, pads, and other elements specified in the original CAD design plated to copper thickness requirements. I will identify some key design considerations for pattern plating, break down the process, and offer design tips for a successful outcome.
PCBAIR Upgrades Heavy-Copper PCBs to Solve AI Thermal Bottlenecks
01/20/2026 | PRNewswireAs computational demands for AI models surge, the hardware powering them faces a critical physical limitation: thermal management.
TÜV Rheinland Advances Electronics Supply Chain Traceability
01/13/2026 | BUSINESS WIREWith electronic devices being replaced at an ever-faster pace, global volumes of consumer e-waste continue to climb.