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IPC APEX EXPO 2020 Attendees Speak: Victor MendezFebruary 28, 2020 | I-Connect007 Editorial Team
Estimated reading time: Less than a minute
Victor Mendez, test engineer with Sigmatron International
Andy Shaughnessy: Tell me a little bit about your background.
Victor Mendez: My company is from Tijuana, and we do electronics sales services.
Shaughnessy: What’s your impression of the show so far?
Mendez: I’ve seen a lot of new technology that could solve a lot of problems regarding handling and manual soldering. We have a lot of features with parts that are sometimes wrong when the operators load the incorrect part number. We have seen some equipment that scans the bar codes and part numbers to ensure that it is the correct one, as well as make measurements before mounting the components onto the board. We have systems to prevent those kinds of issues, but with this technology, it would be a lot easier, and we could do a lot more production in less time.
For more comments by IPC APEX EXPO 2020 attendees, click here.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.
I have been in and around circuit boards most of my life. I started 20 years ago in my family’s PCB shop, leaving after a couple of years to start my own software company. About a year ago, I returned to the family business, and the first thing I noticed was that nothing had really changed. We were doing the same things in the same way as the day I left. After talking to several experts in the industry, I realized it was worse than that: The manufacturing of PCBs had not changed in 70 years.