-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
February 2022 Issue of PCB007 Magazine Available Now
February 21, 2022 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

During IPC APEX EXPO in San Diego, additive and semi-additive processes were a hot topic. But we heard far more questions than answers. Is additive a disruptive PCB technology? Will it displace tried-but-true subtractive etch technology, or is it merely another tool to have in our toolbox? What does a PCB designer have to do differently? Do EDA tools support it?
How much is it going to cost to get into additive processing? Do the numbers really add up? What sort of ROI are we talking about? What equipment am I going to have to acquire in order to begin additive or semi-additive processing? Where’s all of the R&D?
For the February 2022 issue of PCB007 Magazine, we asked a variety of contributors to address some of these questions and share their insights about additive and semi-additive technology.
Preview or download your PDF copy today on the virtual newsstand or subscribe here for delivery in your e-mailbox.
Suggested Items
Global PCB Market Forecast to Reach $86.5 Billion by 2029 with 5.9% Annual Growth
05/19/2025 | EINPresswire.comThe printed circuit board market size has witnessed steady growth in recent years and the trend is anticipated to continue. Increasing from $65.82 billion in 2024 to $68.75 billion in 2025, it showcases a compound annual growth rate CAGR of 4.5%.
Seoul Semiconductor, Seoul City Join Forces to Enhance Public Safety
05/19/2025 | BUSINESS WIRESeoul Semiconductor Co., Ltd.a leading global innovator of LED products and technology, announced that it has signed a “Standard Safety Design Agreement” with the Seoul Metropolitan Government to enhance citizen safety in tunnels and underpasses throughout the city.
Connection Wins Intel Partner of the Year Award for AI PC
05/16/2025 | BUSINESS WIREConnection, a leading information technology solutions provider to business, government, healthcare, and education markets, is pleased to announce that it has received Intel’s 2025 Partner of the Year award for AI PC. Connection earned this distinction for demonstrating exceptional technology innovation and collaboration in developing solutions and marketing strategies.
Revolutionizing Inspection With Delvitech
05/19/2025 | Nolan Johnson, SMT007 MagazineRoberto Gatti, CEO of Delvitech, shares insights into its Horus machine, a revolutionary innovation in AI-driven inspection technology. This unique system leverages five patented optical heads and custom cameras to perform high-speed, precise inspections. With capabilities that extend beyond traditional limitations, the Horus machine seeks to transform inspection in electronics and microelectronics, as well as the food and pharmaceutical industries, showcasing the versatility and power of its AI-native technology.
Rheinmetall, ICEYE Sign MoU to Establish Joint Venture
05/14/2025 | RheinmetallRheinmetall and globally leading SAR satellite manufacturer ICEYE are further intensifying their cooperation. The two companies intend to establish a joint venture for satellite production. A memorandum of understanding to this effect was signed on 8 May 2025.