Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
The IPC STEM Event Inspires
March 1, 2022 | Barry Matties, I-Connect007Estimated reading time: 1 minute
Once again, IPC APEX EXPO featured its successful STEM event, organized by the IPC Education Foundation, and sponsored by several companies, including I-Connect007. The event had nearly 80 students in person for a hands-on introduction to our industry. After the welcoming comments, the students broke into groups for different activities. While some enjoyed a guided tour of the show floor, upstairs the other students learned how to solder. Then they rotated so that they all had the same opportunities.
These students, many of whom were having their first exposure to the world of electronics, kept focused on the task in front of them—solder a small circuit board that would make a connection for two LEDs to illuminate on the opposite side of the board.
Students sat four to a table, a hot soldering iron next to them, a paper full of instructions, and a chance for some true hands-on learning. As the students worked, volunteer IPC committee members and Emerging Engineers roamed around, helping students where needed and remembering back to their own first experiences in the industry.
Of course, when you set several people at table to complete the task it can quickly turn into a fun competition. We caught up with two students who did just that. (See the video below)
Though this a STEM introduction event, we learned that several of the students we talked to had little intention of pursuing a career in electronics, nonetheless the exposure to the industry demonstrated that possible careers are much larger than they may have imagined before attending the IPC APEX EXPO event.
When asked about their career paths, here are some of their responses:
- I want to be film director
- I’m looking for nursing
- Marine biology
- A career in the film industry
- Probably a STEM field
- Owning a business, having my own business
- I don’t know, but something in the music industry hopefully
- Apprenticeship, electrician
During the event we also interviewed one of the teachers, Melissa Woods, who brought her students to this event and past events. She expressed her desire to continue bringing students to the event because it broadens their horizons and demonstrates new opportunities. Her interview follows.
To read this entire article, which appeared in the Real Time with… IPC APEX EXPO 2022 Show & Tell Magazine, click here.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.