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September 2022 Issue of Design007 Magazine Available Now
September 9, 2022 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
In our August issue of SMT007 Magazine, "supply pain management" was the topic of discussion. This reminds us of the question that doctors often ask: “What’s your pain level on a scale of 1–10?”
Designers and design engineers have learned to navigate this supply chain craziness, snatching up components that are in short supply or making do with lower-tech parts that are available.
Supply chain management is a dynamic situation, with a number of global forces that can create pain for PCB designers. In this issue, we speak with a variety of experts and bring you up-to-the-minute insight about designing PCBs in this ever-changing environment. Take a breath and prepare to work through the supply pain as you flip through the pages of this month's Design007 Magazine.
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Merlin Circuit Technology Achieves Prestigious JOSCAR Accreditation
01/14/2025 | Merlin Circuit TechnologyMerlin Circuit Technology is proud to announce it has been awarded the coveted Joint Approvals Group for Industry (JAG) Standard 001 (JOSCAR) accreditation.
Ensuring Compliance with the U.S. CHIPS Act: Identifying the Source of Electronic Components
01/13/2025 | Dr. Eyal Weiss, CybordThe U.S. CHIPS Act aims to strengthen domestic semiconductor manufacturing and enhance supply chain security. As part of this initiative, manufacturers must ensure compliance with specific regulations regarding the sourcing of electronic components. This white paper provides an overview of the compliance requirements, relevant laws and standards, and introduces innovative technological solutions to verify the provenance of electronic components.
SAMI-AEC Showcases Cutting-Edge Technological Solutions at IKTVA 2025
01/13/2025 | SAMISAMI Advanced Electronics Company (SAMI-AEC), a subsidiary of SAMI, is proud to announce its participation in the “IKTVA Forum and Exhibition 2025,” the region’s leading event for energy sector supply chains.
Department of Commerce Announces CHIPS Incentives Award with Hemlock Semiconductor to Help Secure U.S. Production Capacity of Semiconductor-Grade Polysilicon
01/09/2025 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Hemlock Semiconductor (HSC) up to $325 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.
The Government Circuit: How IPC Drove Industry Progress Through Public Policy Advocacy in 2024
01/07/2025 | Chris Mitchell -- Column: The Government CircuitIn 2024, IPC Government Relations continued to shift the narrative about electronics manufacturing in the halls of government, overcoming decades of policymaker indifference in Washington and Brussels. In Asia, where several governments have taken significant strides to foster their domestic electronics ecosystems, IPC broadened its government relations efforts.