- design007 Magazine
Latest IssuesCurrent Issue
The Standards of Design
Our expert contributors discuss how PCB designers can utilize standards to save time and money, not to mention frustration. We also spotlight the newly updated version of the IPC Checklist, a handy guide that illustrates which standards cover which topics, from front-end design through assembly.
Rigid-flex: Designing in 3D
In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered!
- Events||| MENU
- design007 Magazine
An Opportunity to Give ThanksNovember 24, 2022 | Andy Shaughnessy, PCB Design007
Estimated reading time: 1 minute
It’s been a good, busy, and interesting year for all of us, and I know we’re all ready to visit with our families and carve a giant turkey today. I think we’ve all earned a little down time, don’t you agree?
In the spirit of gratitude, we wanted to take this opportunity to offer thanks. First, thank you to our readers for making us a regular part of your workday. When you get right down to it, we work for you, and we appreciate your support. Next, let’s give our columnists and contributors a round of applause—we couldn’t do it without them. They’re truly the best and the brightest in the industry. Each month they provide you with the most cutting-edge technologies and practices, and our pages are better for it. A heartfelt thank you to our contributors.
Finally, let’s hear it for our advertisers. Many of these companies have worked with us for over a decade, sharing their products, services, and technologies. It’s mutual support and we couldn’t do this without them. So, to all our customers, thank you for your support and understanding that your messages in I-Connect007 truly are good for the industry.
From I-Connect007, have a Happy Thanksgiving!
HyRel Technologies, a global provider of quick turn semiconductor modification solutions, is pleased to announce a strategic partnership with EQC Southeast as its manufacturers' representative.
The Cambridge Open Zettascale Lab is hosting Dawn, the UK’s fastest artificial intelligence (AI) supercomputer, which has been built by the University of Cambridge Research Computing Services, Intel and Dell Technologies.
Keysight Technologies, Inc. and MediaTek have successfully completed 5G New Radio (NR) and 5G reduced capability (RedCap) interoperability development testing (IODT) based on the 3GPP Release 17 (Rel-17) standard. The testing verified the latest MediaTek 5G modem technologies using Keysight’s 5G Network Emulation Solutions.
The U.S. Government’s announcement of a national strategy for “advanced packaging” under the CHIPS for America Program is a big step toward ensuring the resiliency and security of the U.S. supply chain for advanced electronics.
iNEMI Packaging Tech Topic Series Webinar, LSI/PKG/PCB Co-Design to Support 3D-IC/Chiplet Design will be held on November 28, 2023, by guest speaker Kazunari Koga, Zuken Inc.