Connect the Dots: Best Practices for Prototyping
Designer’s Notebook: DFM Principles for Flexible Circuits
Elementary, Mr. Watson: Flex Designs—The Future and BeyondAn Opportunity to Give Thanks
November 24, 2022 | Andy Shaughnessy, PCB Design007Estimated reading time: 1 minute
It’s been a good, busy, and interesting year for all of us, and I know we’re all ready to visit with our families and carve a giant turkey today. I think we’ve all earned a little down time, don’t you agree?
In the spirit of gratitude, we wanted to take this opportunity to offer thanks. First, thank you to our readers for making us a regular part of your workday. When you get right down to it, we work for you, and we appreciate your support. Next, let’s give our columnists and contributors a round of applause—we couldn’t do it without them. They’re truly the best and the brightest in the industry. Each month they provide you with the most cutting-edge technologies and practices, and our pages are better for it. A heartfelt thank you to our contributors.
Finally, let’s hear it for our advertisers. Many of these companies have worked with us for over a decade, sharing their products, services, and technologies. It’s mutual support and we couldn’t do this without them. So, to all our customers, thank you for your support and understanding that your messages in I-Connect007 truly are good for the industry.
From I-Connect007, have a Happy Thanksgiving!
Share on:
Suggested Items
Kyocera AVX is Acquiring Assets of Bliley Technologies
10/02/2023 | PRNewswireThe asset transfer acquisition will bring Bliley's equipment, people, and IP under the KYOCERA AVX umbrella and allow KYOCERA AVX to produce the same high-quality electronic components that made Bliley a global leader.
Sasken Technologies Collaborates with Qualcomm through IoT Accelerator Program
10/02/2023 | PRNewswireSasken Technologies, a global leader in cutting-edge technology solutions, is excited to announce a collaboration with Qualcomm Technologies, Inc., a pioneer in wireless technologies, through the Qualcomm® IoT Accelerator Program.
USPAE, DoD Launch $10 Million Defense Business Accelerator to Innovate Commercialization of Advanced Electronics
09/29/2023 | USPAEIn a major initiative to innovate how the Department of Defense (DoD) spurs commercial technology development, the U.S. Partnership for Assured Electronics (USPAE) and DoD launched a Defense Business Accelerator (DBX) to open doors for industrial base growth and stimulate private investment.
Founder of HyRel Technologies Brian Watson to Present at SMTA International on Workforce Development
09/27/2023 | HyRelHyRel Technologies, a global provider of quick turn semiconductor modification solutions, is proud to announce that Brian Watson, the company’s Founder and President, will be a featured presenter at SMTA International. The event is scheduled to take place on Tuesday, October 10.
Pivoting on Substrates
09/27/2023 | I-Connect007 Editorial TeamOved Shapira is CEO of PCB Technologies, the Israeli-based printed circuit provider. PCB Technologies has recently invested in facilities and expertise to design, fabricate, and assemble substrates, a key component for advanced packaging technologies. Oved spoke with Barry Matties and Nolan Johnson about how advanced packaging will influence the industry. He said it will shift everything, including design, fabrication, assembly techniques, and capital equipment development. Some of these shifts might be subtle, and others more seismic. Whatever the changes, Oved says it’s coming.