Beyond Design: AI-driven Inverse Stackup Optimization
Global PCB Connections: Following DFM Rules Leads to Better Boards
Elementary Mr. Watson: How to Reinvent Your Professional Journey
An Opportunity to Give Thanks
November 24, 2022 | Andy Shaughnessy, PCB Design007Estimated reading time: 1 minute
It’s been a good, busy, and interesting year for all of us, and I know we’re all ready to visit with our families and carve a giant turkey today. I think we’ve all earned a little down time, don’t you agree?
In the spirit of gratitude, we wanted to take this opportunity to offer thanks. First, thank you to our readers for making us a regular part of your workday. When you get right down to it, we work for you, and we appreciate your support. Next, let’s give our columnists and contributors a round of applause—we couldn’t do it without them. They’re truly the best and the brightest in the industry. Each month they provide you with the most cutting-edge technologies and practices, and our pages are better for it. A heartfelt thank you to our contributors.
Finally, let’s hear it for our advertisers. Many of these companies have worked with us for over a decade, sharing their products, services, and technologies. It’s mutual support and we couldn’t do this without them. So, to all our customers, thank you for your support and understanding that your messages in I-Connect007 truly are good for the industry.
From I-Connect007, have a Happy Thanksgiving!
Share on:
Suggested Items
EdgeCortix Joins AI-RAN Alliance to Accelerate the Integration of AI and Next-gen RAN Infrastructure
12/20/2024 | EdgeCortixEdgeCortix, a leading fabless semiconductor company specializing in power-efficient AI processing, today announced its membership in the AI-RAN Alliance.
GlobalFoundries Sets New Bar as Largest Semiconductor Company to Protect Innovation by Joining LOT Network
12/19/2024 | GlobalFoundriesGlobalFoundries (Nasdaq: GFS) (GF) and LOT Network announced that GF has joined the LOT Network, the world’s largest patent licensing platform and non-profit community of global companies committed to protecting themselves against costly litigation from patent assertion entities (PAEs). With this move, GF joins a community of more than 4,500 companies that include half of the top 20 largest U.S. patent holders, and half of the S&P Global 100 and Fortune 100.
SEMICON Korea 2025 to Spotlight Edge Technologies Shaping the AI Era
12/18/2024 | SEMISEMICON Korea 2025 will take place Feb. 19-21 in Seoul at the COEX offering a comprehensive look into AI-driven technological advancements and edge technologies poised to shape the future of the global semiconductor industry. Themed
Honeywell, Sino Jet Expand Collaboration With New Memorandum Of Understanding
12/17/2024 | HoneywellHoneywell announced that it has signed a memorandum of understanding (MoU) with Sino Jet at the Middle East and North Africa Business Aviation Association (MEBAA) show.
Toray Engineering Launches TRENG-PLP Coater: Panel Level Coater for Advanced Semiconductor Packaging
12/17/2024 | ACCESSWIREToray Engineering Co., Ltd. has developed the TRENG-PLP Coater, a high-accuracy coating device for panel level packaging PLP is an advanced semiconductor packaging technology, for which there is growing demand particularly from AI servers and data centers. Sales of the TRENG-PLP Coater will commence in December 2024.