- design007 Magazine
Latest IssuesCurrent Issue
The Standards of Design
Our expert contributors discuss how PCB designers can utilize standards to save time and money, not to mention frustration. We also spotlight the newly updated version of the IPC Checklist, a handy guide that illustrates which standards cover which topics, from front-end design through assembly.
Rigid-flex: Designing in 3D
In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered!
- Events||| MENU
- design007 Magazine
Cadence’s Allegro X AI Offers 10X Reduction in Turnaround TimeApril 6, 2023 | Cadence Design Systems, Inc.
Estimated reading time: 1 minute
Cadence Design Systems has announced the Cadence Allegro X AI technology, a next-generation system design technology that offers revolutionary improvements in performance and automation. The new AI offering is built on and accessed through the Allegro X Design Platform and offers transformative time savings for PCB design, with placement and routing (P&R) tasks reduced from days to minutes and with equivalent or higher quality compared with manually designed boards.
P&R in PCB design is traditionally a manual time-intensive process that impacts time-to-market. The Allegro X AI technology leverages the scalability of the cloud for physical design automation, offering generative design of the PCB while ensuring the design is electrically correct and manufacturable. The new technology automates placement, metal pouring, and critical net routing, and is integrated with fast signal integrity and power integrity analysis. Using the generative AI capabilities, customers can streamline their system design process achieving a 10X or more reduction in PCB design turnaround time.
The Allegro X AI technology enables the following benefits:
- Improved Productivity: Dramatic reduction in design turnaround time by automating placement, leveraging a scalable architecture that uses compute infrastructure on the cloud.
- Better Quality of Results: Placement automation using generative AI enables feasibility analysis in the early phases of design. Exploring a much larger solution space than what is possible through manual methods, the technology drives optimization of metrics such as shorter wire lengths while adhering to the design constraints.
- Efficient Design Closure: Integrated tightly with system analysis technologies through the Allegro X Platform where the user can optimize the designs for electrical and thermal performance.
“Cadence is committed to delivering system design solutions that incorporate the power of AI and cloud technology to ensure the fastest turnaround times,” said Michael Jackson, corporate vice president of R&D at Cadence. “The new Allegro X AI technology extends Cadence’s technology leadership in PCB design and provides a transformative impact, offering customers greater productivity through AI-powered automation, improved engine performance and integration with Cadence’s system design and analysis product portfolio.”
The new Allegro X AI technology supports Cadence’s Intelligent System Design strategy, which enables customers to accelerate system innovation. Customers can learn more at www.cadence.com/go/AllegroXAI.
Samsung Foundry certified Ansys' RaptorX on-chip electromagnetic (EM) solution for analyzing high-speed products manufactured with Samsung's 8nm (nanometer) LN08LPP Low Power Plus silicon process.
Seven microelectronics firms received nearly $10 million in combined funding to commercialize technologies of interest to the U.S. military services as winners of the Defense Business Accelerator (DBX) Microelectronics Challenge. This groundbreaking initiative is funded by the Department of Defense (DoD) and led by the U.S. Partnership for Assured Electronics (USPAE).
Horizon Sales is pleased to announce the newest addition to its team, Mr. Andre Kundert. Joining the company in November 2023, Andre brings with him two years of invaluable experience in surface mount technology (SMT) and a robust background in the electronics manufacturing industry.
The goal of the collaboration is to promote the standardization of post-quantum cryptography.
Hyundai Mobis is poised to secure new orders for premium vehicle displays, characterized by large screens, high definition, and slim design, using a fusion of innovative technologies targeting global automakers.