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Merlin Circuit Technology Achieves Prestigious JOSCAR Accreditation

01/14/2025 | Merlin Circuit Technology
Merlin Circuit Technology is proud to announce it has been awarded the coveted Joint Approvals Group for Industry (JAG) Standard 001 (JOSCAR) accreditation.

Happy’s Tech Talk #36: The LEGO Principle of Optical Assembly

01/14/2025 | Happy Holden -- Column: Happy’s Tech Talk
Dr. Steven Case of Avanti Optics Corporation once advocated a new approach to photonic assembly, based on the LEGO principle. He compared today’s erbium-doped fiber amplifier (EDFA) technology to the crude point-to-point wiring of early model circuit boards, which gave way to modern circuit boards that could be considered prefabricated interconnects.

Expansion, Retirement, and New Leadership at FCT

01/09/2025 | Marcy LaRont, PCB007 Magazine
In the dynamic landscape of interconnect solutions, Flexible Circuit Technology (FCT) is making waves through significant leadership changes and expansion initiatives. Vice President Carey Burkett, newly appointed executive vice president Ray Cottrell, and marketing director Abby Meyer share their vision for steering the company toward innovative growth. FCT has a robust focus on diverse markets such as medical, automotive, consumer electronics, and HDI (high density interconnect). They are accelerating FCT’s mission to provide exceptional value and service to customers throughout the product lifecycle.

Flexible Thinking: Another PCB Design Paradigm Shift in the Works

01/09/2025 | Joe Fjelstad -- Column: Flexible Thinking
We all read from the same technology scriptures and sing from the same design hymnals that serve the global congregation of printed circuit manufacturers and users, though there are still a few iconoclasts and heretics to challenge them in the service of largely positive change. Even subtle changes are hard to effect. People, especially those in manufacturing, do not like change because it disrupts the manufacturing floor routine. However, change, as even the ancient philosophers knew, is constant and required for continued growth and evolution.

Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup

01/07/2025 | Vern Solberg -- Column: Designer's Notebook
To accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.
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