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The Standards of Design
Our expert contributors discuss how PCB designers can utilize standards to save time and money, not to mention frustration. We also spotlight the newly updated version of the IPC Checklist, a handy guide that illustrates which standards cover which topics, from front-end design through assembly.
Rigid-flex: Designing in 3D
In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered!
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IPC Issues Call for Participation for ECWC16, IPC APEX EXPO 2024June 8, 2023 | IPC
Estimated reading time: 2 minutes
IPC is now accepting abstracts for technical paper presentations and technical posters for the Electronic Circuits World Convention 16 (ECWC16) at IPC APEX EXPO 2024, and professional development courses at IPC APEX EXPO 2024. The technical conference will be held April 9-11, and professional development courses will take place April 7-8, and 11, 2024, at the Anaheim Convention Center in Anaheim, Calif.
The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers, and executives from all segments of the industry worldwide.
The Electronic Circuits World Convention (ECWC16) is an international PCB symposium held every three years, in different cities worldwide. ECWC provides a valuable platform to encourage knowledge sharing about the latest information on global PCB demand, PCB manufacturing processes, and to promote the domestic PCB industry in every country and every region.
To recognize exceptional achievement, the IPC Technical Program Committee (TPC) will select the top qualifying papers and one top poster for awards. Awards include “Best of Conference,” “NextGen Best Paper,” “Best Student Research Paper,” and “Best Technical Poster.”
“IPC is proud to be the host of ECWC16,” said Julia Gumminger, manager, IPC professional development and events. “We look forward to seeing the exciting new work from our colleagues in the global electronics manufacturing industry. Attendees of technical sessions will benefit from a broader perspective on what’s next in electronics manufacturing. Our professional development courses remain one of the strongest offerings at IPC APEX EXPO, where experts from all areas of the industry, including design, materials, assembly, processes, equipment, and Industry 4.0 share their expertise.”
For technical conference paper presentations and posters, ECWC16 and IPC seek abstracts that describe significant results from research experiments, highlight new techniques or materials, and/or discuss cutting-edge trends and challenges facing the electronics manufacturing industry. All submissions must be non-commercial, summarizing original and previously unpublished work covering case histories, research, and discoveries. Conference speakers are entitled to a free one-day conference pass for the day of their presentations. Papers will be published in a proceedings document, and both paper and poster presentations will be delivered in person at ECWC16 at IPC APEX EXPO 2024 in Anaheim. Deadline for abstract submissions is September 18, 2023.
For professional development courses, IPC seeks abstracts for three-hour sessions of live instruction covering all aspects of electronics manufacturing. Courses can be offered as one 3-hour session or two 3-hour sessions (offered as Part 1 & Part 2 for a total of 6 hours). Honoraria and travel expense stipends are offered to professional development instructors. Professional development abstracts are due August 28, 2023.
To submit an abstract, visit www.ipcapexexpo.org/CFP. For more information on IPC APEX EXPO 2023, visit www.ipcapexexpo.org.
Silicon Mountain Participates in Successful 3rd Annual Idaho Manufacturing Industry Trade Show & Conference12/01/2023 | Silicon Mountain
Silicon Mountain, a leading electronic manufacturing company, is pleased to announce its participation in the 3rd Annual Idaho Manufacturing Industry Trade Show & Conference, hosted by the Idaho Manufacturing Alliance.
Ciena, a U.S.-based networking systems, services and software company, is adding domestic manufacturing through an expanded agreement with global diversified manufacturer Flex.
Keysight Technologies, Inc. announces that Arbe has selected the E8719A Radar Target Solution (RTS) to test the Arbe 4D imaging radar chipset for automotive applications.
TT Electronics, a global provider of custom power solutions and engineered technologies, has announced that its Power and Control business has officially opened its new state-of-the-art research, development and manufacturing facility.
November’s issue of Design007 Magazine had an excellent theme that evolved around design simplification. There were exceptionally good articles about how to reduce over-constrained or needlessly complex designs. One significant time-consuming category is the creation of many design files and drawings which lead to lengthy creation and interpretation time along with the considerable time to resolve conflicting or erroneous information.