Beyond Design: Slaying Signal Integrity Villains
Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Thermal Characterization of LEDs: Enabling the Upcoming Lighting Revolution
October 29, 2014 | Dr. John Parry, CEng., Mentor GraphicsEstimated reading time: 1 minute
According to a June 2012 report from the Climate Group, many commercially available, outdoor light-emitting diode (LED) products offer high-quality light, durability, and significant electricity savings in the range of 50 to 70%. More European cities are adopting LED streetlights because LEDs can save energy costs, while exceeding local lighting standards. They last 50,000 to 100,000 hours, change little in color, and have a failure rate of around 1%, compared, for example, to up to 10% for ceramic metal halide fixtures over a similar time period. LED streetlights are a gateway technology--when LED designers solve the current problems of reducing cost and thermal challenges, they’ll be paving the way for wider adoption and the energy-saving potential of LEDs.
Thermal management is one of the more complex areas of LED system design. And until a few years ago, the methods and technology to scientifically characterize the thermal behavior of the component, as well as its systems and subsystems, were not available. Instead, most engineers calculate their thermal needs from data sheets published by component manufacturers. Understandably, having data available to engineers on the specific thermal mechanics of LED-based devices within the system in which they are being used could be a huge step forward for future lighting designs.
This article describes a method that combines hardware measurement (a thermal transient tester), and computational fluid dynamics (CFD) software to provide high measurement throughput, which enables systems integrators to verify a vendor’s thermal resistance data during design and to test incoming commercial off-the-shelf parts before they are introduced into production. This data can be used during the design and product development phase to accurately capture the thermal response of an LED lighting system.
Read the full article here.
Editor's Note: This article originally appeared in the October 2014 issue of The PCB Design Magazine.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Technica USA Advocates for PCBAA Membership Among Printed Circuit Assembly Customers
09/16/2025 | Technica USATechnica USA is actively encouraging its printed circuit assembly customers to join the Printed Circuit Board Association of America (PCBAA), a leading industry organization advocating for increased domestic production of printed circuit boards (PCBs) and substrates.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
Staying on Top of Signal Integrity Challenges
09/16/2025 | Andy Shaughnessy, Design007 MagazineOver the years, Kris Moyer has taught a variety of advanced PCB design classes, both online IPC courses and in-person classes at California State University-Sacramento, where he earned his degrees in electrical engineering. Much of his advanced curriculum focuses on signal integrity, so we asked Kris to discuss the trends he’s seeing in signal integrity today, the SI challenges facing PCB designers, and his go-to techniques for controlling or completely eliminating SI problems.
TTM Technologies to Exhibit at the Electronica India 2025 Exhibition in Bengaluru, India
09/16/2025 | Globe NewswireTTM Technologies, Inc., a leading global manufacturer of technology solutions, including mission systems, radio frequency (RF) components, RF microwave/microelectronic assemblies, and quick-turn and technologically advanced printed circuit boards (PCBs), will exhibit at the Electronica India 2025 trade fair, at Hall 3, booth #H41, from September 17-19, 2025, at the Bangalore International Exhibition Centre, Bengaluru, India.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.