-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Thermal Characterization of LEDs: Enabling the Upcoming Lighting Revolution
October 29, 2014 | Dr. John Parry, CEng., Mentor GraphicsEstimated reading time: 1 minute
According to a June 2012 report from the Climate Group, many commercially available, outdoor light-emitting diode (LED) products offer high-quality light, durability, and significant electricity savings in the range of 50 to 70%. More European cities are adopting LED streetlights because LEDs can save energy costs, while exceeding local lighting standards. They last 50,000 to 100,000 hours, change little in color, and have a failure rate of around 1%, compared, for example, to up to 10% for ceramic metal halide fixtures over a similar time period. LED streetlights are a gateway technology--when LED designers solve the current problems of reducing cost and thermal challenges, they’ll be paving the way for wider adoption and the energy-saving potential of LEDs.
Thermal management is one of the more complex areas of LED system design. And until a few years ago, the methods and technology to scientifically characterize the thermal behavior of the component, as well as its systems and subsystems, were not available. Instead, most engineers calculate their thermal needs from data sheets published by component manufacturers. Understandably, having data available to engineers on the specific thermal mechanics of LED-based devices within the system in which they are being used could be a huge step forward for future lighting designs.
This article describes a method that combines hardware measurement (a thermal transient tester), and computational fluid dynamics (CFD) software to provide high measurement throughput, which enables systems integrators to verify a vendor’s thermal resistance data during design and to test incoming commercial off-the-shelf parts before they are introduced into production. This data can be used during the design and product development phase to accurately capture the thermal response of an LED lighting system.
Read the full article here.
Editor's Note: This article originally appeared in the October 2014 issue of The PCB Design Magazine.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Peters Spotlights ELPEPCB® HSP 801 S at productronica
10/22/2025 | PetersThe ELPEPCB® HSP 801 S heatsink paste is considered a premium product for Peters when exhibiting at the upcoming productronica. At the world’s leading trade fair for electronics development and manufacturing which will take place in Munich from November 18 to 21, 2025.
Zhen Ding Builds a New Blueprint of “Semiconductor + Advanced Packaging + PCB” “One ZDT”
10/22/2025 | Zhen DingZhen Ding builds a new blueprint of “Semiconductor + Advanced Packaging + PCB” “One ZDT” strategy rides the wave of heterogeneous integration to seize the AI industry high ground.
SCHMID Group Secures Major Orders for AI Server PCB Production Equipment
10/22/2025 | SCHMID GroupSCHMID Group, a global equipment maker and solution provider for Printed Circuit Boards (PCB) and IC-Substrate manufacturing – announced the successful acquisition of two significant orders in the fast-growing field of PCB for artificial intelligence (AI) server applications. So called AI-Server-Boards.
Nano Dimension Announces Chief Financial Officer Transition
10/22/2025 | Nano Dimension Ltd.Nano Dimension Ltd., a leader in digital manufacturing solutions, announced that Assaf Zipori, Chief Financial Officer, will be transitioning from his role, effective November 1, 2025.
PCBA Market Poised to Reach $147.5 Billion by 2035
10/20/2025 | Globe NewswireGlobal printed circuit board assembly market is projected to reach $147.5 billion by 2035, at a CAGR of 4.7% during the forecast period 2025-2035