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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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Component Selection for Easier Design and Manufacture of ElectronicsDecember 17, 2014 | Joe Fjelstad, Verdant Electronics
Estimated reading time: 1 minute
“Simplify, simplify, simplify.”
—Henry David Thoreau
Thoreau penned his simple lifestyle mantra more than 150 years ago and it still as valid today as it was when he first captured and recorded his thoughts on paper. He was not the first to extoll the importance of simplicity, but he said it in a memorable way.
Achieving simplicity has been deemed a worthy objective by many philosophers over centuries, and people often profess to seek simplicity in their lives. In the world of high tech, simplicity is arguably one of the foundational objectives of most of the technologies that surround us today. Certainly this is true in terms of how product designers are trying to create interfaces that allow even the most nontechnical users to get what they need from electronic products with a minimum of hassle.
However, that interface simplicity is undergirded by a massively complex electromechanical substructure of circuits, sensors and components. Pop open any high-end electronic device and you will be met by an impressive mass of densely packed components and circuits. Presently, those components are available in a wide array of formats, with a number of different lead shapes and forms along with the device’s mechanical outline. Presently, there are J-leads, I-leads, gull-wing leads, posts, balls and no leads at all. Mechanical outlines are generally square and rectangular, but the bodies can have a wide range of dimensions in X, Y and Z. While area array technology has helped to make things smaller, it has also upped the complexity factor from a design perspective by mixing grids and land shapes and sizes.
Why so many options? It is because there is not, nor has there ever been, a truly coherent approach to the process of selecting package structures for ICs or any other components for that matter. Yes, a roadmap for electronic component lead pitch was introduced with the advent of SMT, and that roadmap said that every next-generation lead pitch should be 80% of the size of the previous generation lead pitch.
Read the full article here.
Editor's Note: This article originally appeared in the November 2014 issue of The PCB Design Magazine.
Siemens Joins Semiconductor Education Alliance to Address Skills and Talent Shortage in Global Semiconductor Industry02/29/2024 | Siemens Digital Industries
Siemens Digital Industries Software announced today it has joined the Semiconductor Education Alliance to help build and nurture thriving communities of practice across the integrated circuit (IC) design and Electronic Design Automation (EDA) industries, from teachers and schools to universities, publishers, educational technology companies and research organizations.
At DesignCon, the I-Connect007 Editorial Team met with Brad Griffin, product marketing group director for the System Analysis Group at Cadence Design Systems. Brad explains how this analysis tool enables designers to address SI and PI issues early in the design process, before they become costly errors, and why he believes his late co-worker Dennis Nagel would be proud to see his efforts come to fruition.
Sondrel, a leading provider of ultra-complex chips for leading global technology brands, announces that it has secured two new contracts to supply Design Consultancy Services for a Network processor chip and a Radio Transceiver chip.
With the seemingly endless ways that electronic products are worming their way into our lives, what was once “nice to own” is increasingly considered indispensable. The capabilities of these products have been driven by relentless improvements at every level of the manufacturing chain, from individual transistors (which are approaching Angstrom levels) to systems the size of buildings supporting Bitcoin mining and increasingly distributed AI products.
Indium Corporation to Showcase Proven EV Products and High-Reliability Alloys at Productronica China02/28/2024 | Indium Corporation
As a materials pioneer and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 20-22, in Shanghai.