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In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered!
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This month, our contributors focus on designing PCBs with advanced, complex and emerging technologies. We investigate design strategies for boards that are on the cutting edge of technology, or crazily complex, or so new that designers are still writing the rules as they go.
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PADS Paper, Part 4: QFN Components
June 3, 2015 | Mentor GraphicsEstimated reading time: Less than a minute

This paper, the fourth and final in a series downloaded by thousands of PCB designers, is dedicated to CAD library quality. It describes every aspect you need to consider when creating quad flat no-lead (QFN) component library parts.
It also describes the impact each feature has in the PCB process. To read this paper, click here.
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09/27/2023 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Kyocera International has finalized the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine.
Unlocking Synergies
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