-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current Issue
Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
Power Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Polar Instruments Fine-Tunes Layer Stackup Management
November 16, 2015 | Pete Starkey, Real Time with...productronicaEstimated reading time: Less than a minute
Polar Instruments CEO Martyn Gaudion and Technical Editor Pete Starkey discuss Polar’s efforts to simplify specification issues related to the supply chain. Designing PCBs with mixed materials makes layer stackup management more difficult than ever, but Gaudion explains how Polar works closely with materials providers and CAD tool companies in order to provide users with constantly updated information.
To view this video, click here.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
The Impact of the AI Boom on PCB and Raw Materials Supply Chains
11/13/2025 | Mark Goodwin, Ventec International GroupThe PCB industry is entering a period of unprecedented structural change, driven by the demands of artificial intelligence and advanced computing. What was once a cyclical market has become a capacity race. It’s one that rewards foresight, collaboration, and strategic supply partnerships. Understanding these dynamics is essential for maintaining stability and growth across all market segments. This report, created by Ventec International Group, provides a clear view of how AI-driven demand is reshaping the PCB materials landscape and what actions are required to secure long-term supply.
UHDI Fundamentals: An Overview of UHDI Substrate Materials and Vias
11/13/2025 | Anaya Vardya, American Standard CircuitsThe rapid proliferation of 5G/6G communications, Internet of Things (IoT), high-performance computing (HPC), AI, and medical electronics has driven the need for increasingly compact, high-performance circuit packaging. UHDI, defined by feature sizes well below traditional HDI, addresses these demands by enabling ultra-fine lines, dense via interconnects, and embedded passive functionality. Understanding the materials and layering strategies in UHDI is essential for advancing both manufacturing and application design
MacDermid Alpha Electronics Solutions to Feature an Integrated Materials Platform Engineered for Long-Term Reliability at Productronica
11/12/2025 | MacDermid Alpha Electronics SolutionsEvery advancement in electronics raises expectations for enhanced performance and environmental stewardship. Meeting these challenges demands materials engineered for reliability and developed to support sustainable manufacturing. Industry momentum across connected devices, high-reliability automotive electronics, and rapidly increasing compute density is elevating the role of materials selection as a core driver of long-term system performance.
Real Time with... SMTAI 2025: Enhancing Device Reliability With Innovative Materials from MacDermid Alpha Electronics Solutions
11/10/2025 | Real Time with...SMTAIMarcy LaRont speaks with Anna Lifton, MacDermid Alpha Electronics Solutions, who discusses the significance of reliability in devices through advanced materials. Anna highlights MacDermid Alpha's foray into polymer chemistry, showcasing new UV curing materials that address electrochemical reliability and thermal cycling challenges. The conversation also covers the difficulties hardware manufacturers encounter, particularly in thermal management and environmental compatibility.
SEMI Foundation Honors Applied Materials at SEMICON West with 2025 Excellence in Achievement Award for Talent Development
11/04/2025 | SEMIThe SEMI Foundation announced it recognized Applied Materials, Inc. with the Excellence in Achievement Award at SEMICON West 2025 in Phoenix, Arizona, honoring the company’s outstanding leadership and collaboration in building the next generation of semiconductor talent.