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Good In, Good Out: Bay Area Circuits Discusses Data Strategies
December 2, 2015 | Barry Matties, I-Connect007Estimated reading time: 2 minutes
A lot of companies talk about the importance of good data management, but for some firms, this amounts to little more than lip service. Then there are companies like fabricator Bay Area Circuits. I recently sat down with Bay Area Circuits President Stephen Garcia and COO Brian Paper to discuss how automating and upgrading their data systems has significantly cut down overall process time, as well as their drive to educate young PCB designers and actively promote the industry to the emerging electronics industry workforce.
Barry Matties: Let’s talk about how you manage your data. Are you a completely electronic company?
Stephen Garcia: We have tried to go as paperless as possible, and we're talking actual production data starting from the Gerber. We use Ucamco's Integr8tor software, which is the entire company's backbone. That is our database. Everything is automated. And then we've tied in our own software to connect supplement Integr8tor.
Matties: When you say your own software, is that something you developed?
Garcia: Yes, it's basically a customized CRM platform. Some production data, like process cards, are still printed, but eventually everything is digitized and stored on our servers for easy access which is especially important given that a good portion of our engineering staff works remotely and needs real-time access to data.
As we continue to grow and identify bottlenecks, we make sure employees have the access they need. Not long ago, QC may have been inspecting a job but may not have all the details. Maybe they just had a fab print and the process card, so would have to walk over to Planning and say “I'm seeing something out of the ordinary; was this approved by the customer?” Today they have full access. Each job gets a tool number, and then everything is saved on our server for employees to access the data required.
That's the hardest part of our job: incomplete or conflicting customer data. Every customer is different when it comes to Gerbers and their fab prints. We have a handful of customers who often provide us with Gerbers that rarely match the fab print. It might be a non-plated hole on their fab print, but then their Gerber is plated, things of that nature. Our system allows employees to have access to the data to investigate any issues and prevent production hiccups.
Brian Paper: We've put more emphasis on the netlist too, as far as ensuring that the customers are providing us with that type of information. We just posted a whole blog post on what a netlist is, and why it's important.
Garcia: With every customer being different, our biggest challenge is trying to educate them about what we need to successfully manufacture their project and why we need it. It’s amazing that even when some of our larger customers put on a generic fab print, half of it doesn't apply to the actual board, and we need to get approval. We say, “Hey, can we deviate away from your fab print?” and they say, “Yeah, that shouldn't be there. Just ignore it.” It definitely slows things down. We've really tried to automate as much as possible from the minute we get Gerbers.
To read this entire article, which appeared in the November 2015 issue of The PCB Design Magazine, click here.
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Cut Through the Noise: I-Connect007 Previews APEX EXPO 2026 With ‘5 Things You Need to Know’
02/18/2026 | I-Connect007 Editorial TeamAs APEX EXPO 2026 approaches, I-Connect007’s February magazines focus on exclusive pre-event coverage designed to cut through the noise and highlight the technologies and processes that engineers and manufacturers are actively evaluating today. Titled "The 5 Things You Need to Know About…”, this series brings together expert insights from leading companies across the electronics manufacturing ecosystem. Each contributor distills five essential takeaways within their area of expertise, providing readers with a practical preview of the technologies, processes, and strategic conversations shaping this year’s APEX EXPO.
Indium Engineer Examines Key Factors Impacting Improvements in Metal TIMs at TestConX 2026
02/17/2026 | Indium CorporationIndium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2026, taking place March 1-4 in Mesa, Arizona.
New SASinno Ultra-i1 Gives K&F Electronics Added Flexibility in Selective Soldering
02/16/2026 | K&F ElectronicsK&F Electronics, a third-generation, family-owned electronics assembly provider, has installed a SASinno Ultra-i1 offline selective soldering system, expanding its selective soldering capacity and improving process consistency for customer programs that require precise, repeatable results.
EIPC Winter Conference Review: A Focus on Miniaturization
02/12/2026 | Pete Starkey, I-Connect007The theme of the first technical session of EIPC’s Winter Conference in Aix-en-Provence on Feb. 3 was “Miniaturisation and fine-line PCB production: From design to manufacturing.” The session was moderated by EIPC Vice President Thomas Michels, CEO of ILFA in Germany. The theme of the conference is “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The opening presentation came from applications engineering specialist Dr. Roland Steim of Dyconex in Switzerland, who described how the company has addressed the challenges of miniaturisation and fine-line PCB production.
Designers Notebook: Heterogeneous Interposer Design Challenge, Part 2
02/16/2026 | Vern Solberg -- Column: Designer's NotebookAs the need grows for higher processing speed and the expanded functionality required for newer generations of central processing units (CPUs), the necessity for higher-density interconnect solutions is paramount. The current trend toward furnishing a single, monolithic system-level semiconductor package has become a serious yield issue in fabrication. For example, with all of the peripheral supporting functions on a single die platform, wafer fabrication yields are often below target and, although the CPU portion of a monolithic semiconductor may be perfect, if one or more of the supporting functions on the same die fails, the entire processor unit must be discarded.