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Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process

09/21/2023 | Cadence Design Systems, Inc.
Cadence Design Systems, Inc. announced it has expanded its design IP portfolio on TSMC’s 3nm (N3E) process—most notably with the addition of the flagship Cadence® 224G Long-Reach (224G-LR) SerDes PHY IP, which has achieved first-pass silicon success.

KYZEN to Place AQUANOX A4626 and the PCS at Centerstage for SMTA Guadalajara Expo and Tech Forum

09/21/2023 | KYZEN'
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Guadalajara Expo and Tech Forum, scheduled to take place Oct. 25-26, 2023 at the Expo Guadalajara in Guadalajara, Jalisco, Mexico.

Multifunctional Coating & Dispensing with Rehm at Bondexpo

09/20/2023 | Rehm Thermal Systems
For several years now, Motek/Bondexpo in Stuttgart has been a consistent part of Rehm Thermal Systems' trade fair calendar. The focused orientation of the trade fair on the process chain of joining/connecting through adhesive bonding, potting, sealing, and foaming makes it an ideal platform for Rehm, especially in the areas of Conformal Coating and Dispensing.

Murray Percival Offers Exclusive End-of-Summer Sale on Depanelizers

09/20/2023 | Murray Percival Company
The Murray Percival Company proudly unveils its latest promotion, spotlighting its range of depanelizers.

Plasma-Therm Announces Acquisition of Thin Film Equipment SrL

09/20/2023 | Plasma-Therm
Plasma-Therm, a leading manufacturer of plasma-process equipment for the semiconductor and compound semiconductor markets, announced that it has acquired Thin Film Equipment SrL (TFE), effective September 18, 2023.
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