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Joe Fjelstad to Keynote at TIE Design Conference in Romania April 20-23
April 19, 2016 | Andy Shaughnessy, PCBDesign007Estimated reading time: Less than a minute
The Tehnici de Interconectare in Electronica (Interconnection Techniques for Electronics) PCB design conference takes place April 20-23 in Suceava, Romania. Joe Fjelstad, founder of Verdant Electronics, will give the keynote speech titled, “An Overview of Electronic Manufacturing Technology Evolution and Trends.” The keynote will kick off the awards ceremony on the evening of April 22.
The event brings together the leaders of Romania’s academia and the electronics industry, culminating in a PCB design contest for college students. Thirteen universities will send three PCB designers each to TIE. The students will spend four days in PCB design workshops and compete in a design contest known as “The Olympic Games for PCB Designers.” Winners are awarded a “PCB Designer Certificate of Competence.”
The TIE conference was founded by Dr. Paul Svasta, a professor of electrical and electronic manufacturing at Politehnica University of Bucharest – CETTI. This year marks the 25th TIE conference.
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Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.