-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Joe Fjelstad to Keynote at TIE Design Conference in Romania April 20-23
April 19, 2016 | Andy Shaughnessy, PCBDesign007Estimated reading time: Less than a minute
The Tehnici de Interconectare in Electronica (Interconnection Techniques for Electronics) PCB design conference takes place April 20-23 in Suceava, Romania. Joe Fjelstad, founder of Verdant Electronics, will give the keynote speech titled, “An Overview of Electronic Manufacturing Technology Evolution and Trends.” The keynote will kick off the awards ceremony on the evening of April 22.
The event brings together the leaders of Romania’s academia and the electronics industry, culminating in a PCB design contest for college students. Thirteen universities will send three PCB designers each to TIE. The students will spend four days in PCB design workshops and compete in a design contest known as “The Olympic Games for PCB Designers.” Winners are awarded a “PCB Designer Certificate of Competence.”
The TIE conference was founded by Dr. Paul Svasta, a professor of electrical and electronic manufacturing at Politehnica University of Bucharest – CETTI. This year marks the 25th TIE conference.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Foxconn's Rotating CEO, Yang Qiujin, Named One of Asia's Most Influential Women
10/15/2025 | Foxconn ElectronicsHon Hai Precision Industry Co., Ltd.'s management team has once again received recognition! Rotating CEO Kathy Yang has been named to Fortune magazine's " Most Powerful Women Asia 2025 " list of the 100 most influential women in Asia , achieving a remarkable fifth place in her debut.
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.
NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
10/13/2025 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event brings together engineers, product designers, manufacturers, educators, and community partners for a full day of industry connection, learning, and networking.