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Joe Fjelstad to Keynote at TIE Design Conference in Romania April 20-23April 19, 2016 | Andy Shaughnessy, PCBDesign007
Estimated reading time: Less than a minute
The Tehnici de Interconectare in Electronica (Interconnection Techniques for Electronics) PCB design conference takes place April 20-23 in Suceava, Romania. Joe Fjelstad, founder of Verdant Electronics, will give the keynote speech titled, “An Overview of Electronic Manufacturing Technology Evolution and Trends.” The keynote will kick off the awards ceremony on the evening of April 22.
The event brings together the leaders of Romania’s academia and the electronics industry, culminating in a PCB design contest for college students. Thirteen universities will send three PCB designers each to TIE. The students will spend four days in PCB design workshops and compete in a design contest known as “The Olympic Games for PCB Designers.” Winners are awarded a “PCB Designer Certificate of Competence.”
The TIE conference was founded by Dr. Paul Svasta, a professor of electrical and electronic manufacturing at Politehnica University of Bucharest – CETTI. This year marks the 25th TIE conference.
Dixon wholly owned subsidiary- Padget Electronics Private Limited enters into an Agreement with Xiaomi to carry out manufacturing of smart phones and other related products for Xiaomi.
USPAE, DoD Launch $10 Million Defense Business Accelerator to Innovate Commercialization of Advanced Electronics09/29/2023 | USPAE
In a major initiative to innovate how the Department of Defense (DoD) spurs commercial technology development, the U.S. Partnership for Assured Electronics (USPAE) and DoD launched a Defense Business Accelerator (DBX) to open doors for industrial base growth and stimulate private investment.
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, is proud to announce that it is sponsoring the Women’s Leadership Program Connection Reception to be held at SMTA International.
The practical question around CHIPS Act development and electronics assembly is, “Will this change how we do business?” Indium Corporation’s Dr. Andy Mackie sat down with Nolan Johnson to share what he sees as emerging answers to that question from his perspective as an expert in electronics assembly and packaging, and as a participant in standards development through IPC, JEDEC, and SEMI.
ZESTRON is happy to announce that Senior Application Engineer, Ravi Parthasarathy, will be presenting "Revolutionizing PCB Assembly Cleaning: