-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRigid-flex: Designing in 3D
In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered!
Simulation, Analysis, and AI
Getting today’s designs “right the first time” is critical, especially with costly advanced PCBs. Simulation and analysis software tools can help you in the fight to eliminate respins. They’re not magical, but they can predict the future of your design.
Advanced, Complex & Emerging Designs
This month, our contributors focus on designing PCBs with advanced, complex and emerging technologies. We investigate design strategies for boards that are on the cutting edge of technology, or crazily complex, or so new that designers are still writing the rules as they go.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Joe Fjelstad to Keynote at TIE Design Conference in Romania April 20-23
April 19, 2016 | Andy Shaughnessy, PCBDesign007Estimated reading time: Less than a minute
The Tehnici de Interconectare in Electronica (Interconnection Techniques for Electronics) PCB design conference takes place April 20-23 in Suceava, Romania. Joe Fjelstad, founder of Verdant Electronics, will give the keynote speech titled, “An Overview of Electronic Manufacturing Technology Evolution and Trends.” The keynote will kick off the awards ceremony on the evening of April 22.
The event brings together the leaders of Romania’s academia and the electronics industry, culminating in a PCB design contest for college students. Thirteen universities will send three PCB designers each to TIE. The students will spend four days in PCB design workshops and compete in a design contest known as “The Olympic Games for PCB Designers.” Winners are awarded a “PCB Designer Certificate of Competence.”
The TIE conference was founded by Dr. Paul Svasta, a professor of electrical and electronic manufacturing at Politehnica University of Bucharest – CETTI. This year marks the 25th TIE conference.
Suggested Items
Dixon's Padget Electronics Enters an Agreement with Xiaomi for Manufacturing of Smart Phones
09/29/2023 | DixonDixon wholly owned subsidiary- Padget Electronics Private Limited enters into an Agreement with Xiaomi to carry out manufacturing of smart phones and other related products for Xiaomi.
USPAE, DoD Launch $10 Million Defense Business Accelerator to Innovate Commercialization of Advanced Electronics
09/29/2023 | USPAEIn a major initiative to innovate how the Department of Defense (DoD) spurs commercial technology development, the U.S. Partnership for Assured Electronics (USPAE) and DoD launched a Defense Business Accelerator (DBX) to open doors for industrial base growth and stimulate private investment.
KYZEN: Find the Power in Personal Branding at the SMTAI 2023 Women’s Leadership Program
09/28/2023 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, is proud to announce that it is sponsoring the Women’s Leadership Program Connection Reception to be held at SMTA International.
The End of Solder?
09/28/2023 | Nolan Johnson, I-Connect007The practical question around CHIPS Act development and electronics assembly is, “Will this change how we do business?” Indium Corporation’s Dr. Andy Mackie sat down with Nolan Johnson to share what he sees as emerging answers to that question from his perspective as an expert in electronics assembly and packaging, and as a participant in standards development through IPC, JEDEC, and SEMI.
ZESTRON to Present 'Revolutionizing PCB Assembly Cleaning' at SMTA International
09/28/2023 | ZESTRONZESTRON is happy to announce that Senior Application Engineer, Ravi Parthasarathy, will be presenting "Revolutionizing PCB Assembly Cleaning: