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The Standards of Design
Our expert contributors discuss how PCB designers can utilize standards to save time and money, not to mention frustration. We also spotlight the newly updated version of the IPC Checklist, a handy guide that illustrates which standards cover which topics, from front-end design through assembly.
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In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered!
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Cadence Expands OrCAD to Address Flex and Rigid-Flex ChallengesMay 3, 2016 | PRNewswire
Estimated reading time: 3 minutes
Today at CDNLive EMEA, Cadence Design Systems, Inc. announced the OrCAD 17.2-2016 release with new capabilities for OrCAD Capture, PSpice Designer and PCB Designer that address challenges with flex and rigid-flex design as well as mixed-signal simulation complexities in IoT, wearables and wireless mobile devices. This latest release reduces PCB development time by addressing the need to design reliable circuits for smaller, more compact devices.
This OrCAD portfolio includes technology enabled for integrated rigid-flex planning, design and real-time visualization, as well as built-in translators that enable direct design imports from select EDA vendors. PSpice Designer now supports system-level simulation using C/C++/SystemC and VerilogA, via the new PSpice compact model interface. This enables hardware/software virtual prototyping so that electrical engineers can design and simulate intelligent IoT devices. OrCAD is the only fully scalable PCB design solution available in the market that seamlessly transitions from mainstream to enterprise PCB solution with the Allegro environment. For more information on the latest OrCAD solution, click here.The new Cadence OrCAD solution provides a complete scalable and an integrated solution from schematics to simulation to layout using Capture, PSpice Designer and PCB Designer that address challenges with flex and rigid-flex design as well as mixed-signal simulation complexities in IoT, wearables and wireless mobile devices.
To enable a faster and more efficient flex and rigid-flex design creation critical to IoT, wearables and wireless devices, the OrCAD portfolio uses a new multi-stack-up database capability and extensive in-design inter-layer checks, which helps users avoid errors introduced through manual checking. The OrCAD portfolio also features enhancements targeted towards improving PCB editors' productivity and ease-of-use in padstack editing, constraint management, shape editing and in-design DRCs. To address efficiency needs, the portfolio includes an advanced design differencing engine that enables design review with global teams using state of art visuals. Finally, to give designers more control over their design component annotation process, advanced annotation and auto-referencing capabilities are now available.
"This latest OrCAD release has given us confidence in getting a functional PCB without CAD errors the first time. Prior to this, we were always cautious that our PCB packages would introduce unforeseen errors and we would have to factor one spin of the board that was barely functional," said David Edwards, founder and CEO of Abicom. "Cadence has built tools that are enabling us to develop better designs faster, while giving us a better understanding of expected performance. This advancement has saved us upwards of £3-8K per new board design."
"OrCAD continues to be the clear choice for new and existing companies designing IoT, wearable and mobile products," said Dirk Müller, CEO, FlowCAD EDA-Software Vertriebs GmbH. "The new flex and rigid-flex capabilities allow designers to create faster and smarter products in a timely and cost-effective manner."
"Our customers are demanding solutions that address their broader system-design challenges," saidSteve Durrill, senior product engineering group director, SPB Solutions at Cadence. "The latest OrCAD release provides upfront virtual prototyping support in PSpice, support for high-speed interfaces and a comprehensive implementation solution for rigid/flex designs. We are confident this latest release of the OrCAD solution provides the time to market savings our customers require."
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. Visit www.cadence.com.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.
I have been in and around circuit boards most of my life. I started 20 years ago in my family’s PCB shop, leaving after a couple of years to start my own software company. About a year ago, I returned to the family business, and the first thing I noticed was that nothing had really changed. We were doing the same things in the same way as the day I left. After talking to several experts in the industry, I realized it was worse than that: The manufacturing of PCBs had not changed in 70 years.