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Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC’s Advanced 4nm RF FinFET Process

09/28/2023 | Keysight Technologies, Inc.
Keysight Technologies, Inc., Synopsys, Inc., and Ansys announced a new reference flow for the TSMC N4PRF, the world's leading semiconductor foundry's advanced 4 nanometer (nm) radio frequency (RF) FinFET process technology.

Rigid-flex Design Guidelines 

09/27/2023 | Cherie Litson, CID+, Litson1 Consulting
Rigid-flex circuits are unique structures; part rigid board and part flex, they’re increasingly working their way into many of the electronic devices we use every day. There have been many advances in rigid-flex lately as more companies find themselves exploring this technology. So, before I started writing this article about rigid-flex design, I double-checked a few things. Fortunately, there is plenty of rigid-flex information available on a variety of great websites that we all know and trust.

Three Things to Improve High-Speed PCB Signoff, Part 2

09/27/2023 | Brad Griffin, Cadence Design Systems
Another challenge for SerDes is losses within the channel design. At high speeds, dielectric material can be very lossy, making the appropriate selection of the right material, length, etc., critical for the channel. Many questions about stackup, trace widths, and height from the ground plane need to be defined up front. Simulating a signal with a topology explorer tool extracted from the design can be used to set up and run sweep parameters and push min/max length/spacing values into the Allegro schematic constraint manager (system capture).

Keysight EDA 2024 Integrated Software Tools Shift Left Design Cycles to Increase Engineering Productivity

09/27/2023 | Keysight Technologies, Inc.
Keysight Technologies, Inc. introduces Keysight EDA 2024, a tightly integrated suite of electronic design automation (EDA) software tools that ensures first pass success.

Pivoting on Substrates

09/27/2023 | I-Connect007 Editorial Team
Oved Shapira is CEO of PCB Technologies, the Israeli-based printed circuit provider. PCB Technologies has recently invested in facilities and expertise to design, fabricate, and assemble substrates, a key component for advanced packaging technologies. Oved spoke with Barry Matties and Nolan Johnson about how advanced packaging will influence the industry. He said it will shift everything, including design, fabrication, assembly techniques, and capital equipment development. Some of these shifts might be subtle, and others more seismic. Whatever the changes, Oved says it’s coming.
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