-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current Issue
Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
Power Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Signal Integrity Tools and Design Methodology in the Modern Age
August 15, 2016 | Dennis Nagle, Cadence Design SystemsEstimated reading time: 2 minutes
The PCB design process has traditionally been done in silos. One group creates the design intent (schematic), another group implements the logic on the PCB, and yet another group does some checking of the design using analysis tools. This traditional approach has run into a number of problems.
The first problem was that prototypes were showing up in the lab that did not work due to complicated signal and power integrity problems not found by the analysis tools. But even when the analysis team equipped themselves with sophisticated analysis tools, the back-and-forth between silos or lack of time in the schedule tended to create chaos as design deadlines loomed.
Today, modern PCB design methodology offers a more team-oriented solution. With a front-to-back constraint driven approach that enables all groups to get involved with signal and power integrity, many potential problems are either avoided or found early in the design process. With first order problems removed, the analysis team, with their sophisticated tools, is better positioned to focus on design sign-off so prototypes come back working the first time.
This article is focused on how each part of that design team can get out of their silo and work cooperatively. Using a common constraint manager, each group can utilize their varying levels of expertise to ferret out signal and power integrity problems.
Pre-Layout
For teams seeking to break out of their historic silos, tools can help by providing a certain amount of integration. One way that can happen is by having a constraint system integrated with your SI system at all stages of your design process. While decisions are being made for physical partitioning, component/IP selections, and power requirements, pre-layout analysis can help define your solution space and corresponding electrical constraints. This early analysis as part of a well-executed constraint driven flow saves time and prevents issues from propagating down to SI signoff.
Topology analysis is usually what comes to mind when thinking of pre-layout analysis and is an ideal environment for what-if analysis. Here you can start from scratch or by extracting nets from design data in the schematic or layout. In either case you can quickly build a representation of the major interfaces in the design. Models for active devices should be as accurate as possible and interconnect can be estimated or parameterized and swept.
To read this entire article, which appeared in the July 2016 issue of The PCB Design Magazine, click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
NASH Industries Unveils its First Series of 'Make in India' Motherboards Powered by Intel's Raptor Lake Platform
11/25/2025 | PRNewswireNASH Industries recently announced the successful launch of its first series of 'Make in India' motherboards, designed and developed using the Intel B760 chipset for Intel's Raptor Lake (RPL) processor family.
Fairbanks Morse Defense to Acquire Truflo Marine from IMI
11/25/2025 | BUSINESS WIREFairbanks Morse Defense (FMD), a portfolio company of Arcline Investment Management, has entered into an agreement with IMI plc, to acquire its Birmingham, UK-based Truflo Marine business.
Target Condition: May I Take Your Order, Please?
11/26/2025 | Kelly Dack -- Column: Target ConditionAnyone who has ordered a car knows you don’t just stroll onto the lot, casually mention you want “a red one,” and drive away happy. There’s a process: You sit down with the dealer, pick your make and model, choose your options—engine size, interior trim, transmission type, sunroof—and agree on a price. Then the paperwork starts flying.
What Emerging Circularity Policies Mean for the Electronics Industry
11/20/2025 | I-Connect007 Editorial TeamAs Europe accelerates toward a circular economy, electronics manufacturers face a wave of new sustainability requirements that will redefine product design, materials management, and end-of-life strategies. During a Nov. 11 webinar co-hosted by the Global Electronics Association and the Anthesis Group, industry leaders outlined the regulatory landscape shaping the next decade, including the Eco-design for Sustainable Products Regulation (ESPR), the Right to Repair (R2R) Directive, and the Extended Producer Responsibility (EPR) regulatory framework.
TTCI Receives 2025 Global Technology Award for Redefining Design for Testability in High-Reliability Electronics
11/20/2025 | TTCIThe Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, has been awarded the 2025 Global Technology Award in the Test Services category for its groundbreaking work in Design for Testability (DFT).