Latest Articles

India and Southeast Asia: Strengthening Global Electronics Manufacturing Through Skills, Standards, and Collaboration

As the global electronics industry convenes at APEX EXPO 2026, the India and Southeast Asia region stands out as one of the most active and strategically important contributors to the global electronics ecosystem. Rapid manufacturing expansion, sustained workforce development, and growing alignment with global standards are reshaping how the region engages with international supply chains. For the Global Electronics Association, APEX EXPO provides an important platform to reflect on recent progress across India and Southeast Asia and to advance collaboration with global industry stakeholders.

Real Time with... APEX EXPO 2026: Technology Advancements and Partnership Growth with Technica

Jason Perry, president of Technica, U.S.A., discusses the company's significant advancements. This interview covers Technica's integration into EMC Group, growth in their PCB and PCBA business, and new national distributor partnerships. Jason also highlights upcoming technical demo days focusing on emerging technologies and AI.

Finding the Funny: Jan McInnis Headlines Women in Electronics Keynote

In an industry driven by precision, deadlines, and innovation, laughter may not be the first tool professionals think to reach for, yet it’s one that can transform workplace culture, elevate collaboration, and boost personal well-being. Jan McInnis, comedian and humor strategist, presents “Finding the Funny” for the Women in Electronics Keynote, from 6 to 7:30 p.m. March 18, at APEX EXPO.

East Asia at APEX EXPO 2026: Focusing on Cross-regional Exchange and Industry Connectivity

At APEX EXPO 2026, the Global Electronics Association East Asia team will promote engagement with global experts, industry partners, and member companies by participating in technical committee meetings and industry forums, and by organizing networking dinners and exhibitor visits. More than 40 companies from East Asia are expected to exhibit at this year’s show, representing Mainland China, Taiwan Region, Japan, and Korea.

Mexico at APEX EXPO 2026: Building the Future Together, One State at a Time

As the electronics industry gets ready for APEX EXPO 2026 in Anaheim, Mexico returns with something very important to say: we are building the future of electronics together—across regions, industries, and borders. This will be the second year in a row that Mexico participates with an organized Mexico Pavilion, coordinated by Global Electronics Association Mexico. What started in 2025 as a historic first step is now becoming a sustained national effort, bringing Mexican states, companies, and institutions to the global stage with one shared vision.

Dan Feinberg: From Ham Radio to Hall of Fame Stories

For more than two decades, Dan Feinberg has helped shape PCB007 as a columnist, technical editor, and trusted industry voice. In this interview, Dan reflects on a lifetime in electronics—from ham radio and rock bands to PCB innovation, executive leadership, and consulting—revealing the experiences that fueled his career and his enduring passion for the industry.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s time for my five must-reads featured this past week. The global economy is still reeling from last Friday’s U.S. Supreme Court ruling that most tariffs imposed under IEEPA by President Trump are unconstitutional. In other news, with APEX EXPO just two weeks away, we're featuring the first three Real Time with... pre-show sponsor interviews: Remtec, Burkle North America, and KYZEN. These are insightful and forward-thinking interviews about what you can expect to see at the show this year. Please check them out!

After IEEPA: What Electronics Companies Should Know About Tariff Refund Strategies and Section 122

The U.S. Supreme Court’s recent decision striking down tariffs imposed under the International Emergency Economic Powers Act (IEEPA) opens the door to potential refunds for electronics companies and signals a rapid pivot to alternative trade statutes, setting the stage for a volatile 150-day period that could significantly affect global electronics supply chains. Trade and electronics industry leaders gathered for a webinar hosted by the Global Electronics Association on Feb. 24 to learn more about the landmark U.S. Supreme Court decision.

Technology Pavilion Debuts at APEX EXPO 2026

Many of the technologies shaping the future of electronics manufacturing, particularly in areas such as 3D integration, digital manufacturing, advanced design workflows and automated metrology, are moving faster than traditional publication and standards cycles. The APEX EXPO 2026 Technology Pavilion will bring technology innovators such as these to the forefront, through a dedicated space where emerging tools, approaches, and early-stage breakthroughs can be shared with attendees.

Growing an Engineer: Meet Emerging Engineer Julian Vega

Julian Vega started as a 17-year-old intern who rose to planning supervisor at Summit Interconnect in just seven years, and credits the Global Electronics Association’s Emerging Engineer program for fueling his passion and accelerating his career journey. In this interview, Julian shares how the program expanded his technical perspective, connected him with industry leaders, and helped shape his vision for the future.

Real Time with... APEX EXPO 2026: Remtec Expands Microelectronics Assembly

Julio Castillo and Chris Dougherty from Remtec discuss their expanded capabilities in microelectronic assembly, including chip and wire and multi-chip module component attachment. They highlight their expertise in ceramic substrates for high-reliability, high-power, and harsh environment applications, offering integrated solutions.

Big Ideas Take the Stage: APEX EXPO 2026 Keynotes

Some of the most consequential conversations in electronics manufacturing will take center stage at APEX EXPO 2026, with a keynote lineup that spans quantum computing, advanced packaging, artificial intelligence, and the global electronics economy. From IBM and Intel technologists to an AI futurist and a global industry leader, this year’s keynote speakers will offer attendees both technical depth and strategic perspective on the forces reshaping the electronics ecosystem.

I-Connect007 Launches Six-Part Podcast Series Highlighting the Critical Role of PCB Materials

I-Connect007, the leading media source for the electronics manufacturing industry, today announced the release of the first episode in a new six-part podcast series, “PCB Materials: The Backbone and Future of Electronics.”

Real Time with... APEX EXPO 2026: Exploring PCB Fabrication and Industry 4.0 Innovations with Burkle

Nolan Johnson speaks with Andy Turner, CEO of Burkle North America, about PCB fabrication and pressing technologies. They discuss the significance of Industry 4.0, focusing on machine integration and data collection for improved manufacturing efficiency. The conversation covers Burkle's adoption of the Open Platform Communications Unified Architecture (OPC UA) protocol for better data sharing and the role of AI and automation in enhancing processes and customer interactions.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Frankly, there were so many worthy news items this week, it quite a bit of whittling to get it down to my five must-reads. For example, this week we showcased Schweitzer Engineering Labs’ new manufacturing facility in Moscow, Idaho. Marcy LaRont launched an On the Line With… podcast on materials, and the February issue of I-Connect007 Magazine features the annual APEX EXPO preview.

New IPC Standards Released

Each quarter, the Global Electronics Association releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit electronics.org/ipc-standards. These are the latest releases for Q1 2026.         

Changing the Electronics Systems Conversation

Rebranding as the Global Electronics Association is not the only major change happening at APEX EXPO this year. There’s also a shift in the scope of the technical program as heterogenous integration and other advanced packaging methodologies come into the mainstream at both the component and system levels. We spoke with Matt Kelly, CTO and conference general chair, Devan Iyer, chief strategist for advanced electronic packaging, and Stan Rak and Udo Welzel, now in their fourth year as chairs of the Technical Program Committee, about what distinguishes the conference this year.

IPC Standards: The Heart of the Electronics Industry

From its very inception, standards development has been at the core of the Global Electronics Association’s work, and APEX EXPO continues to serve as a major venue for standards development and approval. For example, standards committees from around the globe are expected to conduct more than 100 task group meetings during the event. We visited with the Association’s standards development team to learn more about their process, its impact on the industry, and how you can get your voice heard.

EIPC Winter Conference Review: From Innovation to Qualification

Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, I’ve taken some extra time to better learn some video and photo editing software programs we use at I-Connect007. You’ll want to check out my LinkedIn video to see how I brought my avatar to life for this week’s must-reads! The items I’m highlighting this week are also about learning something new, from Pete Starkey’s thorough three-day review of the EIPC Winter Conference in Aix-en-Provence, France, to what’s on the horizon for advanced electronics packaging. I also share details about the new Design Village at APEX EXPO 2026, preview a new column from Remtec’s Chandra Gupta, and discuss why marketing isn’t a one-and-done deal.

High-Tech Hill in Lithuania: Europe’s PCB Comeback

TLT Manufacturing, part of the Teltonika group, is assembling something Europe hasn’t seen in decades: a fully integrated electronics manufacturing hub in Vilnius, Lithuania. Last September, TLT officially opened High-Tech Hill, its new technology campus, simultaneously launching four facilities: two EMS plants, a large greenfield PCB fabrication plant, and a plastic injection molding operation. This move brings design, tooling, production, and full manufacturing services under one roof.

EIPC Winter Conference Review: A Focus on Miniaturization

The theme of the first technical session of EIPC’s Winter Conference in Aix-en-Provence on Feb. 3 was “Miniaturisation and fine-line PCB production: From design to manufacturing.” The session was moderated by EIPC Vice President Thomas Michels, CEO of ILFA in Germany. The theme of the conference is “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The opening presentation came from applications engineering specialist Dr. Roland Steim of Dyconex in Switzerland, who described how the company has addressed the challenges of miniaturisation and fine-line PCB production.

I-Connect007 Announces Newest Columnist Chandra Gupta of Remtec

I-Connect007 is excited to announce its latest columnist, Chandra Gupta, whose new column, Below the Surface, will explore what truly determines performance in advanced electronic packaging, long before a product ever reaches assembly or test. Gupta is a seasoned practitioner who cuts through industry buzzwords to explain how substrate physics, materials, and manufacturing realities actually govern performance in high-reliability electronics.

February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging

I-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging. As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.

EIPC Winter Conference 2026 Review: The Keynote Sessions

Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in