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Top 10 Most-Read Design Articles of 2019

As we move into 2020, we took a look back at the most popular Design007 articles of the past year. Here for your enjoyment are the Top 10 most-read Design007 articles of 2019.

Top 10 Most-Read Design Columns of 2019

As we move into 2020, we took a look back at the most popular Design007 columns of the past year. Here for your enjoyment are the Top 10 most-read Design007 columns of 2019.

Clean vs. No-clean: A Generational Difference

Tom Forsythe, executive VP of KYZEN, discusses what readers should know about cleaning as reliability expectations continue to increase. He also explains what is driving the new interest in cleaning and why engineers from the no-clean generation may not even realize they need to learn more about cleaning.

MacroFab: Manufacturing Digitized

MacroFab CEO Misha Govshteyn explains how a digital manufacturing platform connected to a network of vetted partner factories can help eliminate a lot of variability from the fabrication process.

Wi-Fi 6: Wired vs. Wireless

We all know that it makes no sense to get the latest device just because they come out with a new one every year. Sure, post-millennials tend to want a new phone every year, but most of us are well past that. However, as the competitive nature of the consumer tech industry continues to increase, the rate of change is also accelerating, as is the peer pressure to upgrade. Non-techies get new phones every year, techies get new CPU and GPUs every two years, average consumers get bigger and higher-res TVs every three years, and on it goes.

UV-curable Materials and Conformal Coatings

Pete Starkey and Phil Kinner, global business and technical director, coatings division, Electrolube, discuss the characteristics and benefits of the company’s new UV-cured conformal coatings. Phil also describes the development of coatings for critical avionics applications and Electrolube’s collaboration with the U.K. National Physical Laboratory to establish a new condensation test.

Insulectro Works to Bridge the Fabricator/Designer Gap

Barry Matties sat down with Insulectro’s Megan Teta and Mike Creeden to discuss trends they see in the materials market and how they’re working to bridge the gap between fabrication and design, including helping designers understand what they can do to make a board more manufacturable.

Book Summary: The Printed Circuit Assembler’s Guide to…Process Validation

The latest book in I-Connect007’s "The Printed Circuit Assembler’s Guide to…" series is authored by Gen3’s Graham Naisbitt. With his deep background in process validation and standards work, Naisbitt is uniquely qualified to explore achieving acceptable electrochemical reliability using both CAF and SIR testing. This eBook is a perfect present for the holidays.

Utilizing AI in CAD Library Development

Nolan Johnson speaks with Chico Wu of Footprintku, a company using artificial intelligence (AI) to help fill gaps in CAD library development by partnering with design teams on things like addressing resource shortages and automating custom design rulesets while also eliminating other manual steps in the process.

BTU Discusses its Next-generation Flux Management System

At productronica 2019, Nolan Johnson spoke with Peter Franklin, managing director of BTU Europe, about BTU’s next-generation solder reflow flux management system—Aqua Scrub. A winner of the show’s Global Technology Award for Soldering, Peter breaks down the specifics of what makes Aqua Scrub such an intriguing technology.

CIMS Galaxy: More Than an Inspection System

Editor Pete Starkey and Vladi discuss the newest CIMS AOI platform, Galaxy, which is more compact and more versatile than the previous Phoenix model. The Galaxy is scalable and can be equipped with more functions and connected to a variety of Industry 4.0 databases. Vladi explains that the Galaxy can be used for everything from inner layer inspection to final inspection, detecting defects down to 1 pixel. The system is available with multiple metrology options as well.

Decreasing Bend Radius and Improving Reliability- Part III

Application: Design guidelines to improve the flexibility and reliability of flexible circuits. Most issues that arise with flex circuits can be eliminated in the early stages of the design phase, and special planning must occur when the circuit is required to bend. Many novices will design a circuit that calls for bending the flex in too tight of a bend radius, which can cause damage to the circuit and lower the reliability of the end product.

The Viability of a Cyanide-free Immersion Gold Bath

The Tianjin chemical blast in August 2015 sensitized the Chinese authorities to the use of cyanide in production. As a consequence, the authorities have introduced licensing with regard to the use of cyanide. In turn, this has motivated Chinese PCB manufacturers to ask suppliers for a competent cyanide-free immersion gold solution (CNF Au).

A Walking Tour of Viking Test With Jake Kelly

In this video walking tour of the Viking Test booth at productronica 2019, Managing Director Jake Kelly walks us down the line of Viking's universal film stripper.

Practical Verification of Void Reduction Method for BTC Using Exposed Via-in-pad

The method explored in this article regards the use of exposed via-in-pad. A dedicated test vehicle was designed for two types of QFN components. The main variables accounted for were the component size, number of exposed vias in the thermal pad, via pitch, via size, and solder paste coverage. The responses sought in this experiment include a thermal pad void level and solder wicking down the via barrel with resulting solder protrusion on the opposite side of the PCB.

The ICT 2019 Christmas Seminar

Since 2016, the Institute of Circuit Technology (ICT) has held its northern area Christmas seminar at the Majestic Hotel in Harrogate—the elegant and historic English spa town in North Yorkshire. Pete Starkey provides an overview of this popular ICT event.

The Future of the World Is Truly in the Hands of Our Youth

At I-Connect007, we are proud to once again sponsor the STEM Outreach Program at the upcoming IPC APEX EXPO 2020. Another way we support our youth is by sharing the stories of young people who are doing amazing things. Dylan Nguyen is a great student, musician, and creative thinker. Recently, he shared with me the details of his school science fair project, “Kite: Powering the Future,” which solved a problem that he faced. Dylan is a leader with a bright future, and the world is lucky to have kids like him.

Designing for Complex PCBs

The I-Connect007 editorial team sat down with Freedom CAD’s Scott Miller to talk about the industry’s demand for more increasingly complex PCBs, and the challenges this presents. They also discuss Freedom CAD’s in-house training programs, the company’s recent book authored by Scott, and why communication is such an important tool in a PCB designer’s toolbox.

AltiumLive Frankfurt 2019: Happy Holden Keynote

Nobody left early! Altium had wisely kept Happy Holden’s keynote presentation on “PCB Trends that Will Impact Your Future” until the end of the final day of the AltiumLive 2019 European PCB Design Summit in Frankfurt, Germany. Pete Starkey presents the highlights of Happy's presentation.

Electra Polymers: Inkjet Soldermask is Ready, Reliable and Green

Editor Pete Starkey and Tibbals discuss Electra Polymers’ move into the inkjet soldermask market, and some of the challenges and benefits of this technology. Tibbals explains how inkjet soldermask can enable end-users to improve reliability of the final product, for instance, because this additive process allows manufacturers to control the thickness of soldermask around vias and BGAs and eliminating trapped chemistry in undercut areas.

The CPCA and China’s Electronic Circuit Industry: Past and Future

Wang Longji is the honorary secretary-general of the China Printed Circuit Association. He is a senior engineer and an industry leader and used to be the production manager of the first imported PCB manufacturing line in China. Mr. Wang is also a well-known child actor and a “national treasure;” one of his most famous characters was San Mao in “The Winter of Three Hairs.”

Pluritec Takes Industry 4.0 to the Next Level

Pete Starkey and Pluritec’s Nicola Doria, president and CEO, discuss how the structure of Pluritec has developed over the past few years, now including many respected brand names that are long familiar in the PCB fabrication segment. Doria also explains how the company is continuing its implementation of Industry 4.0 processes.

Indium Discusses New Materials and Plans for 2020

Editor Nolan Johnson sits down with Nash and Mackie to discuss Indium’s focus on creating innovative products for the 5G, automotive, semiconductor, and high-reliability segments. Mackie offers a preview of Indium’s plans for 2020 and beyond, including lead-free drop-in sintering materials that can be dispensed and printed more quickly than ever before.

Industry Set for Shift to True 3D Printing and Photonics

Nolan Johnson sits down with Zach Peterson, owner of Northwest Engineering Solutions, who predicts two things that would challenge the current status quo for the PCB manufacturing industry: true 3D printing and additive, including discretes as well as the substrates and traces, and a completely different approach with photonics.

LA/Orange County SMTA Expo and Tech Forum Review

Dan Feinberg recently attended the LA/Orange County SMTA Expo and Tech Forum, which was held in Long Beach, California. He provides an overview of the activities, from the show floor to the presentations.
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