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EIPC Winter Conference Review: From Innovation to Qualification

Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, I’ve taken some extra time to better learn some video and photo editing software programs we use at I-Connect007. You’ll want to check out my LinkedIn video to see how I brought my avatar to life for this week’s must-reads! The items I’m highlighting this week are also about learning something new, from Pete Starkey’s thorough three-day review of the EIPC Winter Conference in Aix-en-Provence, France, to what’s on the horizon for advanced electronics packaging. I also share details about the new Design Village at APEX EXPO 2026, preview a new column from Remtec’s Chandra Gupta, and discuss why marketing isn’t a one-and-done deal.

High-Tech Hill in Lithuania: Europe’s PCB Comeback

TLT Manufacturing, part of the Teltonika group, is assembling something Europe hasn’t seen in decades: a fully integrated electronics manufacturing hub in Vilnius, Lithuania. Last September, TLT officially opened High-Tech Hill, its new technology campus, simultaneously launching four facilities: two EMS plants, a large greenfield PCB fabrication plant, and a plastic injection molding operation. This move brings design, tooling, production, and full manufacturing services under one roof.

EIPC Winter Conference Review: A Focus on Miniaturization

The theme of the first technical session of EIPC’s Winter Conference in Aix-en-Provence on Feb. 3 was “Miniaturisation and fine-line PCB production: From design to manufacturing.” The session was moderated by EIPC Vice President Thomas Michels, CEO of ILFA in Germany. The theme of the conference is “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The opening presentation came from applications engineering specialist Dr. Roland Steim of Dyconex in Switzerland, who described how the company has addressed the challenges of miniaturisation and fine-line PCB production.

I-Connect007 Announces Newest Columnist Chandra Gupta of Remtec

I-Connect007 is excited to announce its latest columnist, Chandra Gupta, whose new column, Below the Surface, will explore what truly determines performance in advanced electronic packaging, long before a product ever reaches assembly or test. Gupta is a seasoned practitioner who cuts through industry buzzwords to explain how substrate physics, materials, and manufacturing realities actually govern performance in high-reliability electronics.

February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging

I-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging. As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.

EIPC Winter Conference 2026 Review: The Keynote Sessions

Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Here’s the thing about time travel. You can’t just manipulate the time dimension; you have to move in three-dimensional space as well. That’s because Earth orbits a star, which orbits a galaxy, which is on its own path through three-dimensional space. Our planet follows a complex corkscrew-like path through the universe, covering great distances in just seconds. Build a time machine like HG Wells envisioned, and even a short jump in time means that Earth has moved, and you’re now floating in the void of space. Unsettling, to be sure.

PCBAA Sets Its Priorities for 2026: Support in the House and Senate

David Schild, executive director of the Printed Circuit Board Association of America (PCBAA), leads an organization focused on the domestic manufacture of PCBs and substrates to support America’s critical microelectronics supply. In the continuation of this interview, David talks about the ways his organization is aligning its priorities with Washington, in particular, the Executive Branch. It might feel like a snail’s pace, but progress could mean financial support and more domestic security, even for the smaller companies.

What's Next in PCB Fabrication?

If you have been in the PCB business for any length of time, you either know Gene Weiner or know of him. With a career spanning more than six decades, he has been an active member of the Global Electronics Association (formerly IPC) since the early 1960s and was inducted into the  Raymond E. Pritchard Hall of Fame in 2005 in recognition of his lifelong impact on the industry. Having presented hundreds of technical and management papers, he remains a sought-after speaker in the HDI and UHDI space, most recently being recognized at the TPCA conference in Taiwan.

Navigating the Shift: Key Trends Shaping Growth in AI and Electronics Through 2026

Global Electronics Association's Chief Economist Shawn DuBravac offers guidance on how companies can successfully navigate challenges and seize new opportunities in this dynamic industry. First, he says, economic growth will remain dangerously narrow. Prosperity will concentrate on artificial intelligence infrastructure, defense electronics, and high-income consumer spending, while companies outside these lanes face headwinds.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s the last week of January, and it’s been pretty cold outside. That’s the best time to hunker down and catch up on your reading. Here are my top five must-reads for this week. All eyes continue to be on advanced electronics processes and packaging technology, which are highlighted in Pete Starkey’s review of the ICT winter conference in the UK, as well as Nolan Johnson’s article on inflection points, and Kris Moyer’s look forward into what will be important for PCB designers in 2026 and beyond. Candor Industries’ Sunny Patel discusses “Normalizing the Impossible” in his look forward, and Mike Jouppi contributes with his critical look at what IPC-2152 does not cover.

ICT Winter Seminar: Leading-edge Developments in Electronics Manufacturing

Early fog made the journey challenging for those travelling from afar, but it lifted to reveal a clear blue sky over Hinckley, Leicestershire, which is actually closer to the exact geographical centre of England than the familiar Meriden venue, for the Institute of Circuit Technology winter seminar in December. An intriguing programme, focused on some leading-edge developments in electronics manufacturing, more than justified the effort to attend.

How Technology, Materials, and Manufacturing Will Redefine 2026

Matt Kelly, chief technology officer and vice president of standards and technology for the Global Electronics Association, explores how technology, supply chains, sustainability, and standards are redefining the electronics ecosystem. This is the latest installment in a blog series exploring the future of the global electronics industry.

Is Washington Ready to Get Serious About PCBs?

David Schild, executive director of the Printed Circuit Board Association of America (PCBAA), leads an organization focused on the domestic manufacture of PCBs and substrates to support America’s critical microelectronics supply. In part one of this interview, he reflects on how a “perfect storm” during the COVID-19 pandemic actually ignited the conversation that has allowed PCBAA to flourish: Years of advocacy, the shock of COVID-era supply chain disruptions, and the long road to the CHIPS Act have helped to reshape the federal mindset on industrial policy.

MacDermid Alpha White Papers: Practical Materials Guidance for Modern Electronics

The I-Connect007 Industry Resource Center brings together technical white papers from leading suppliers to help electronics professionals navigate today’s manufacturing and reliability challenges. Built as an educational hub, the Resource Center connects engineers and manufacturers with application-focused guidance on materials, processes, and performance considerations shaping modern electronics.

Normalizing the Impossible: The Next Era of PCB Fabrication with Candor

Sunny Patel, technical sales manager at Candor Industries, sees the intersection of advanced manufacturing, operational realities, and strategic foresight. In this interview, Sunny offers a technically-grounded view of what will define PCB fabrication through 2030. It’s not about incremental change, he says, but velocity, physics, and the people willing to get their hands dirty to push the limits of what’s possible.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Lately, I’ve been thinking a lot about storytelling. Partly because I’m reading "Creativity, Inc.," by Ed Catmull, and partly because it’s impossible to separate Pixar’s success from the power of the stories it tells, both on screen and behind the scenes. Everything matters to Pixar—from the technology to the leadership—but what makes Pixar truly special is the stories it tells about human emotions. They make our human complexity understandable.

Resilience Through Adaptation: What to Expect from the Electronics Industry in 2026

What does the future hold for the global electronics industry? Few organizations are better positioned to answer that question than the Global Electronics Association. With a unique, global perspective spanning the electronics supply chain, we work at the intersection of industry, policy, technology, and workforce development by engaging with member companies, governments, and partners across major regions worldwide.

USPAE Grants ‘Greater Access’ to Defense Electronics Manufacturers

Chris Peters, co-founder of the U.S. Partnership for Assured Electronics and expert on manufacturing supply chains, recently announced he would be stepping back from his role. I first met Chris in the spring of 2020, when SMT007 Magazine interviewed him for the July 2020 issue. I was pleased that Chris took the time to reflect on the USPAE, past present and future, and his optimism is infectious.

Symposium Review: A Glimpse Into the Future of IC Substrates and Beyond

The Hong Kong Printed Circuit Association (HKPCA) and the Korea Printed Circuit Association (KPCA), with strong support from SEMI, presented “The Future of IC Substrates and Beyond Symposium 2025” at the Sands Expo and Convention Centre in Singapore in . The event brought together elite professionals, technical experts, and corporate leaders from across the global IC substrate industry chain to explore cutting-edge trends and innovative solutions shaping the future of the sector.

CES 2026 Review: Are We Crossing the Line in Intelligent Systems?

Global Electronics Association senior representatives were impressed by the sheer volume of advanced technology at CES 2026 in Las Vegas last week. “I love the energy and the pace of CES,” said Carrie Sessine, the Association’s chief communications officer, in a LinkedIn post after the event. “There’s so much happening that keeps me moving from one idea to the next.”

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

I was in Chicago this week, where the weather went from sunny and 45° F on the day I arrived to snow and ice by the next morning. As a California/Arizona native, let’s just say I love the look of snow much more than I love driving in it.  Still, I am grateful to have been part of some genuinely fun teambuilding with my colleagues at the Global Electronics Association. My must-reads for this week are a diverse grouping of articles and columns, ranging from printed electronics and additive manufacturing to a comprehensive overview of the European EMS and PCB markets to marketing wisdom and, finally, a book to help you reach your full potential, personally and professionally.

Upcoming Issue: Design, Integration, and the Global Push for Advanced Packaging

The upcoming Jan. 19 issue of Advanced Electronics Packaging Digest examines how advanced packaging is redefining system integration, regional semiconductor strategy, and the materials and technologies shaping next-generation electronics. From interposer design challenges to global collaboration and substrate innovation, this issue offers timely insight into where the industry is headed in 2026 and beyond.

Where Electronics Manufacturing Turns for Trusted Technical Insight

In an industry defined by rapid innovation, increasing system complexity, and mounting pressure to deliver reliable products faster, access to credible technical insight is more important than ever. I-Connect007’s Industry Resource Center was created to serve as a centralized, freely accessible library of in-depth whitepapers that address the challenges facing today’s electronics professionals.
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