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IPC APEX EXPO 2024 Day 2: A Focus on Workforce Development

Solving workforce development issues seemed to be a common theme among many conversations during the second day of IPC APEX EXPO 2024 in Anaheim, California. In his keynote address, “The Future of the Human Workforce: Maximizing Potential in an Automated World,” IPC President and CEO Dr. John W. Mitchell discussed the rapidly evolving workforce climate.

Plastronics and the New IPC Guidelines for In-mold Electronics (IME) 

In the ever-evolving world of electronics, the roads for the integration of electronics assemblies into 3D structures continue to grow into a set of technologies used to produce 3D plastronics parts and revolutionize mainly the automotive industry. IPC has been developing standards for this set of technologies, led by Francisco Fourcade, IPC electronics technology standards manager.

An Ultimate Goal in Sustainability: Recyclable PCBs

Who doesn’t believe in recycling? “Re-use, repurpose, recycle” has been a drumbeat for more than two decades. Our children learn about it in primary school. Full university departments devoted to environmental science and sustainability in universities forward their discipline for the world's benefit. In theory, we all get behind the concept of recycling, even if the nuances of execution may fall short.

Inkjet Solder Mask ‘Has Arrived’

I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.

Feeling the Magic of a Show Opener at IPC APEX EXPO 2024

As we walked the show floor at IPC APEX EXPO on Tuesday, April 9, we were struck by the subtle differences in the feel of the show floor between Anaheim and the previous home in San Diego. Somehow, the large booths seem less dominant, and the smaller booths seem more prominent here in the shadow of Disneyland where everything feels just a little bit magical.

Paul Cooke of Ventec Talks About Glassless Revolution, High Reliability

Marcy LaRont from I-Connect007 caught up with Paul Cooke from Ventec at the SMTA UHDI Symposium on March 26 in Arizona. Paul discusses the challenges in developing future product lines for extremely high density, high reliability manufacturing, and focuses on the transition from glass to glassless substrate technology. He explains the advantages of using pure resin systems, enabling fabricators to create thinner materials for micro vias.

A Closer Look at Professional Development at IPC APEX EXPO 2024: 3D Printing and AI

While the finishing touches were being made to the show floor at IPC APEX EXPO, just as much activity was happening in the conference rooms of the Anaheim Convention Center on the days before the show officially opened. The hallways and classrooms were filled for standards committee development meetings and Professional Development Courses, and IPC hosted evening receptions for Emerging Engineers, ECWC, and those who are attending for the first time in a special “newcomers” event.

IPC APEX EXPO 2024 Readies for Tomorrow’s Show Opener

IPC APEX EXPO is finally happening in Anaheim this week. As we entered the Anaheim Convention Center this past Friday, the weather was colder than expected, but the sun still shone. Making our way to the entrance doors, the small groups of happy but tired-looking Disneyland goers filled our path, as did hundreds of young, sparkle-clad cheerleaders from across the nation whose competition was taking place in a neighboring hall.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Spring has definitely sprung; it was 81 degrees last week in Atlanta, and this week it’s been in the 40s. That’s typical spring weather in Atlanta. My newly cut lawn is looking great, thanks to my “yard guy” Clive. I need to finish packing for IPC APEX EXPO, so without further ado, here’s my must-reads for this week. I hope to see you at APEX next week.

The Impact of U.S. Defense Production Act on PCB Industry

This interview with David Schild, executive director of PCBAA, covers the recent passage of the Defense Production Act and its impact on the printed circuit board industry. It highlights the importance of funding, domestic production, and government support for the industry's growth. He mentions proposed legislation like the Protecting Circuit Boards and Substrates Act and the need for a strategic approach to national security and supply chain resilience.

IPC APEX EXPO 2024: There’s an App for That

With so many things to do at a large trade show and conference like IPC APEX EXPO, you cannot possibly take every class, attend every talk, or see every vendor on your list. But you can plan your days and maximize your time with the IPC APEX EXPO mobile app. The app allows you to easily view the show’s daily agenda, keynote speakers, the conference and professional development schedules, and, of course, flag and make notes on exhibitors.

Checking In With ICAPE Group

ICAPE Group’s field application engineer Erik Pederson drills down on sustainability, supply chain resiliency, and what value engineering really looks like in this exclusive interview. Founded in 1999, European-based ICAPE Group provides 21 million printed circuit boards and over six million technical parts to manufacturers every month. With 30 PCB manufacturing partners globally and 50 partners providing a wide array of technical parts, ICAPE Group has operations in China, Taiwan, Thailand, South Korea, Vietnam, South Africa, Europe, Mexico, and the United States. The company also focuses on the value proposition for its customers.

Collaboration and Innovation: Insights from SMTA's First UHDI Symposium

Anaya Vardya provides valuable insights on industry collaboration and innovation at the first SMTA UHDI Symposium, delving into the necessity of collaboration in driving innovation and progress within our industry. He shares his experience in helping put this event together, and pride in being a part of bringing the UHDI test board to life.

IPC APEX EXPO 2024: Kurt Palmer on the Formation of Schmoll America

There’s exciting news for Schmoll Maschinen as Kurt Palmer leaves his role as president of Burkle North America to lead the new Schmoll America. In this interview, Kurt discusses his collaboration with Burkle North America, what it means for his new Schmoll teams, and the many machines and processes he’ll have on display at his busy booth at IPC APEX EXPO.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We are well into trade show season and what a season it has been so far! SMTA Dallas, IMAPS, and the SMTA UHDI Symposium have filled out the past two weeks as we barrel toward IPC APEX EXPO in just a week’s time. There have been many exciting announcements of equipment and technology that will be showcased at IPC APEX EXPO, including announcements from Ventec, Blackfox, Insulectro, Indium, and more. Click through the news to see what’s in store for the big show.

SMTA Conducts First UHDI Symposium

SMTA’s first UHDI Symposium in Peoria, Arizona, on Tuesday, March 26 featured a standout full-day technical program with 11 separate presentations on what will be required for our companies to move to ultra HDI manufacturing. The event was the brainchild of Tara Dunn, SMTA director of training and education. It included a compelling and collaborative presentation by David Haboud of Altium, John Johnson of American Standards Circuits, and Chrys Shea of Shea Engineering, who had spent the past several weeks creating and building an appropriate SMT test board vehicle for UHDI, something that was passed around for all conference goers to see and touch.

Technica Leads the Way Into Automation and Machine Learning at IPC APEX EXPO 2024

As a significant partner to PCB fabricators since almost the beginning of multilayer boards, Technica USA brings a lot of expertise to the industry. This year’s IPC APEX EXPO show will showcase their biggest booth yet, and a whole lot of information, discussion and demonstration around automation and AI machine learning. In this interview, Jason Perry discusses Technica's plans for the show, and why attendees should stop by.

IPC APEX EXPO 2024: LPKF—Debunking Depaneling Industry Perceptions

In this audio interview, listen to Jake Benz discuss advances in laser depaneling at LPKF. Thanks to advances in laser technology, perceptions about laser depaneling are changing from a low-speed, specialized process to a high volume process suitable for production manufacturing. Benz elaborates on some of the development and engineering that went into creating their latest, most capable depaneling machines.

The IMAPS Show: A Conversation with John Andresakis

On the last day of the IMAPS Device Packaging Conference, Marcy LaRont sat down with industry veteran John Andresakis of Quantic Ohmega, who attended the conference this week. Not his first time at this event, he talked about the conference, advanced technology, and trying to get the word out about the advanced packaging substrates solution Quantic is offering.

The Delicate Balance of Sustainable Business and Going Green

Alex Stepinski is known throughout the industry as an innovator and disruptor committed to environmental sustainability, primarily through his current work around zero liquid discharge (ZLD) for PCB fabrication. But Alex says financial sustainability must come first. Standing firm in his belief that green is the most financially sustainable option for manufacturing and financial success, he explains his position and vision for a greener, more lucrative future for bare board fabricators. “Before I retire in about 10 years,” he says, “I want to make sure that all new fabs, and at least 25% of the old ones are zero liquid discharge in this industry.”

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week's news feed contains a bunch of big money items, as well as some interesting industrial and technology puzzles to be solved. There’s even some down-home people news from the Dallas SMTA conference held this week. Don’t overlook the latest issue of PCB007 Magazine, either. The topic is sustainability, which is becoming an ecosystem of its own.

IMAPS Wrap-up: AI, Chiplets, and 3D Cube Architecture

The International Microelectronics Assembly and Packaging Society, IMAPS, held its 20th Device Packaging Expo and Conference this past week in Fountain Hills, Arizona, followed immediately by a ‘Workshop on Advanced Packaging for Medical Electronics’ that continued through the remainder of Thursday. Fortunate to find myself in Texas earlier in the week, I made it for the last day of the IMAPS event and attended two excellent keynote presentations by AMD and Intel, respectively. Here are some highlights.

Catching Up With Jove PCB’s Cameron Burke

Cameron Burke is the North American director of sales at Jove PCB, who despite his young age, has been in the PCB business for many years because his grandfather was a New England PCB sales rep who took Cameron under his wing. It’s a good story.

IPC APEX EXPO 2024: A Preview of the Women in Electronics Reception

This year’s Women in Electronics Reception is scheduled from 6 to 7:30 p.m. Tuesday, April 9. It will feature a panel discussion led by IPC Hall of Famer Karen McConnell, Northrop Grumman, on work-life balance. Panelists include:

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It was a busy week in PCB design and manufacturing. This has been a pretty “dense” week, and this week’s Top Five features an article on density equations by Happy Holden, and a news item about the SMTA UHDI symposium in Phoenix. We also have news about our latest podcast, and a Chris Mitchell column about economic security here and abroad. And Todd Kolmodin discusses the ins and out of 4-wire Kelvin testing, and he tells us a little about Lord Kelvin himself. 
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