Latest Articles

Exciting New Technology: Thermal Risk Management

Two years ago I entered into a collaboration with Dr. Johannes Adam, from Leimen Germany. Johannes has written a software simulation tool called Thermal Risk Management (TRM). We used it to look at the thermal characteristics of PCB traces under a variety of conditions, and it is hard for me to contain my excitement and enthusiasm for what it does and what we learned about traces using it. Our collaboration resulted in the publication of numerous articles and a book. In this article, I’ll talk about some of the capabilities of TRM that really caught my attention.

CPCA Moves into New Venue for 2017 Show

I-Connect007 China Editor Edy Yu recently interviewed Jin Zhang, CPCA Secretary General, via e-mail. They discussed the upcoming CPCA Show, scheduled for March 7-9, and some recent changes, including the move to a new venue for this year’s annual event.

Vertical Conductive Structures–a New Dimension in High-Density Printed Circuit Interconnect

From our previous conversations, I knew that Joan Tourné was working on a novel high-density interconnection concept. Having eagerly awaited the chance to discuss the technology in detail, I was delighted when he contacted me to confirm that his IP had been secured and that he could now talk openly about VeCS, the Vertical Conductive Structure designed to provide a cost-effective alternative for complex fan-out from fine-pitch grid array components.

RTW IPC APEX EXPO: John C. Maxwell Leadership Training Discussion

Steve Williams discusses his recent certification as a Maxwell Leadership coach and speaker. The discussion centers on the need for leadership development at all levels of an organization. As many companies have found, supervisors are often promoted for their tactical ability, but without the necessary supervisory skills.

RTW IPC APEX EXPO: New Strategies in the U.S. for Eternal Photoresist

Bob Ferguson, CEO of Break Free Strategies and well-known industry executive, talks with Guest Editor Mike Carano (RBP Chemical Technologies) about his role in helping Eternal Materials position its photoresist technology to compete in the North American marketplace.

RTW IPC APEX EXPO: APEX EXPO Wrap-up Roundtable

Publisher Barry Matties and Managing Editor Andy Shaughnessy join Bob Neves of Microtek Labs for a review of IPC APEX EXPO 2017 and a look at the state of the PCB industry.

RTW IPC APEX EXPO: Tara Dunn talks with Clark Webster from All Flex

Clark Webster discusses the increased need for high temperature, high speed materials, new developments in their assembly capabilities and the importance of working with your manufacturer for flex design.

Time-Lapse Video: The IPC APEX EXPO 2017 Show in Under Seven Minutes!

During IPC APEX EXPO 2017, we at I-Connect007 had our time-lapse camera running from setup to closing. The camera was positioned high in our studio, where we conducted our RealTimewith…IPC APEX EXPO video interviews, aimed down the main aisle.

Real Time with...IPC: Don Veri on Meyer Burger's Latest Inkjet Developments

Don Veri, sales and business development for Meyer Burger, discusses the company's newest inkjet technology, as well as their focus on printed electronics.

Patty's Perspective: New Technology Heading our Way— Faster than Ever!

As an excellent introduction to this issue, IPC’s John Mitchell gives us a wonderful overview of what emerging technology is and what we need to do to keep up. One thing he emphasizes is a trained and competitive workforce. Indeed, in our recent hiring survey we learned that an overwhelming percentage of you are concerned about a shortage of skilled and qualified people. John’s column is a great call to action.

Real Time with...IPC: IPC Market Research Update

Sharon Starr updated everyone on the Market Research services, industry forecasting and research projects her group publishes. She also mentioned a "call to action" for a meeting tomorrow with IPC members, seeking input on needed metrics for their new Pulse of the Industry program she will be rolling out this year, which will be a "Industry Health Scorecard".

Real Time with...IPC: American Standard Circuits Strives to Define the Future of PCB Technology

VP of Operations Olson discussed his company's wide range of technology and how they are poised to take on whatever their customers need.

Ladle on Manufacturing: Drilling Deep

Whether you stack high or drill thick panels, the dynamics of drilling are similar. When you overlay the outer-layer artworks you may notice that the holes on the exit side of the panel or stack have a much higher level of positional variation than the entry side holes.

Real Time with...IPC: Jim Fuller Offers HDPUG Update

Sanmina's Jim Fuller gives his insight on how the High-Density Packaging User Group (HDPUG) shares the experience and resources of member companies to tackle projects and get results. Also, he reviews the study of the effect of copper bonding treatment on signal integrity

Real Time with...IPC: MacDermid Enthone Positions Itself to Meet the Needs of the Electronics Supply Chain

Warren Kenzie, Technical Director at Macdermid Enthone, discusses with I-Connect007 Guest Editor Mike Carano the critical need to develop equipment sets that are properly designed to ensure optimal functioning of the production processes. He also noted the need to understand the relationship between materials, chemistry, equipment, and people.

Real Time with...IPC 2017 Videos Now Available for Viewing

Over 70 video interviews from the IPC APEX EXPO 2017 show in San Diego, CA are now available for viewing. See the opening ceremony, hear from suppliers and others on their new products, learn more about the HDP Users Group. Don't miss the videos by IPC President John Mitchell and his staff.

Catching up with…Prototron Tucson’s General Manager Kim O’Neil

Prototron’s Tucson Division serves as the company’s military defense division as well. They focus on mil-spec and aerospace work as well as special technology PCBs such as RF, microwave and flex circuits. During the past few months Kim 0’Neil and his team have been working on updating their mil-spec qualification from MIL-PRF-55110 to MIL-PRF-31032. Since Prototron is one of the first companies to make this transition, I wanted to talk to Kim about this accomplishment.

EIPC 2017 Winter Conference Review of Day 2

Almost everyone made it back to the conference room for the start of the second day of the EIPC Winter Conference in Salzburg, even those who had enjoyed the late networking session into the early hours!

EIPC 2017 Winter Conference Review of Day 1

Themed to address the question: “The Future Needs of the Global Electronics Industry: What Solutions will Europe Provide?" the conference was a truly international event, attracting delegates from thirteen countries, to hear a well-chosen programme of twenty presentations in five sessions, introduced by EIPC Chairman Alun Morgan.

Weiner’s World—January 2017

This month’s column is a bit shorter than usual as we prepare for next month’s IPC APEX EXPO and its Executive Forum for PCB fabricators and their supply chain. This month also marks the 65th anniversary of Epec LLC in New Bedford, Massachusetts. The company, founded in 1952, is the oldest printed circuit fabricator in North America. Half of its $50 million in sales is reported to be with printed circuits.

In Deep: The Art and Science of DFM with Gary Ferrari

When the topic of DFM techniques came up, I knew I had to talk with Gary Ferrari of FTG Corp. Gary has been involved with designing and manufacturing PCBs for decades, and he’s the past co-founder and executive director of the IPC Designers Council. I caught up with Gary between Thanksgiving and Christmas, and we conducted the following interview.

Electroplated Copper Filling of Through-holes: Influence on Hole Geometry

The process consists of a two-step acid copper plating cycle. The first step utilizes periodic pulse reverse (PPR) electroplating to form a conductive copper bridge across the middle of a through-hole and is followed by direct current electroplating to fill the resultant vias formed in the bridge cycle.

Trouble in Your Tank: Acid Copper Plating

Electroplating a printed circuit board is by no means a trivial task. Higher layer counts, smaller-diameter vias (through-hole and blind) as well as higher-performance material sets contribute to the greater degree of difficulty with today’s technology.

True DFM: Taking Control of Your EDA Tool

We PCB designers are doing some truly great things with our layout tools. But we must remember that these tools are so powerful that they will sometimes allow us to design things that can’t be manufactured! We must collaborate with our fabricator and assembly brethren and embrace the best DFM practices, or face the consequences downstream.

IPC Designers Council San Diego Chapter Meeting: Flex Focus Fills the House

A report from the January meeting of the San Diego chapter of the IPC Designers Council. The meeting was hosted by the PCB design bureau San Diego PCB, with the featured guest speaker John Stine of Summit Interconnect. Stine’s presentation focused on flex and rigid-flex DFM, and he offered a variety of helpful design tips to the full house of 30-40 designers in attendance.
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