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Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
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Technica Tech Day Event on AI and the Large BGA Solution Hits the Mark
On May 13–14, 2026, Technica USA hosted its Tech Day Event in San Jose, California, bringing together more than 25 companies and over 60 attendees...
Global Electronics Association Acquires New Venture Research EMS Program
The Global Electronics Association has acquired New Venture Research’s EMS market intelligence program and released new data showing the global EMS...
Critical Manufacturing Expands into Taiwan to Support MES-Driven Industrial Operations Platform
Critical Manufacturing, the industrial operations platform company that unites execution, connectivity, analytics, and trusted AI, has expanded into...
NOTE Opens New Torsby Plant to Boost Sweden's Defence and Critical Sector Supply
NOTE has inaugurated a state-of-the-art manufacturing facility in Torsby, Sweden, reinforcing its long-term commitment to delivering technical...
I-Connect007 Launches Enhanced Homepage to Better Connect the Electronics Industry With News, Expertise, and Resources
The electronics industry moves fast, and staying informed has never been more important. I-Connect007 has launched a redesigned homepage experience...
EWPTE 2026 Demonstrates Continued Industry Growth with More Than 3,100 Total Participants
The 2026 Electrical Wire Processing Technology Expo (EWPTE) brought together the cable and wire harness manufacturing industry for another strong...
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Three Key Takeaways on Material Management From Cogiscan’s Latest White Papers
May 27, 2026 | I-Connect007 Editorial Team
Effective material management has become increasingly critical as PCB assembly operations face mounting pressure to improve efficiency, control costs, and maintain quality in complex manufacturing environments. To help electronics manufacturers navigate these challenges, Cogiscan has contributed two complementary white papers to the I-Connect007 Industry Resource Center, offering practical strategies for improving material visibility, traceability, and production performance.
Standard of Excellence: Building Excellence From the Inside Out
May 27, 2026 | Anaya Vardya, Standard of Excellence
You can’t have a world-class product without a world-class mindset. Every layer, lot, and customer success begins long before a board hits the lamination press or the AOI line. It begins with how people think, care, and take ownership of their work. Culture, in the truest sense, is process control. It governs consistency, integrity, and pride as surely as SPC charts and traveler sheets. If the culture isn’t right, neither will the product be.
MORE ARTICLES
Powering the Future: Why True Ceramic Circuits Are Not Just ‘Better PCBs’
May 20, 2026 | Brian Buyea, Powering the Future
There’s a dangerous misconception among engineers who still think ceramic circuits are just a little tougher version of a PCB, a little better at handling heat, and a premium option when FR-4 starts to struggle. That thinking will...
Global Sourcing Spotlight: The Global Quality Gap—Why Consistency Wins the Contract
May 18, 2026 | Bob Duke, Global Sourcing Spotlight
There was a time when you could tell where a product was from by how it felt, fit, or functioned: German precision, Japanese consistency, or American durability. Today, the lines are blurred. The best factories in Vietnam rival those...
Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components
May 13, 2026 | Nash Bell, Knocking Down the Bone Pile
Underfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder...
Learning with Leo: Drones—Meeting Demand Without Compromise
May 6, 2026 | Leo Lambert, Learning With Leo
With drones used in a wide range of applications today, particularly in modern military conflicts, domestic manufacturers are feeling pressure to produce at high volume and low cost, particularly within an NDAA supply chain ecosystem...
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- North American Electronics: Growth and Challenges with Joe Schneider
- Omega EMS Going Where the Growth Is with Chris Alessio
- Cybersecurity Roundtable: Start Now with Watanabe Hiroyuki, Ali Pabrai, and Divyash Patel
- How New Metals Tariffs Impact the Electronics Industry by James Kim
- Is U.S. EMS Growth Real or Just Repositioning? by Nolan Johnson
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