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Register for Zuken's December 6 Webinar: Best Practices for Using Quick-Turn Parts
November 8, 2017 | ZukenEstimated reading time: Less than a minute
The temporary or quick turn part is a reality in today’s fast-moving design process. In many cases, a search of the corporate library comes up short and you need to explore the supply chain for that perfect part. Starting a design with an unapproved or temporary part is a common occurrence in today’s design environment. This reality has forced all of us to adopt policies and procedures that allow for the use of temporary parts. The biggest challenge with temporary parts is making sure that all of the design’s components have been validated and all remnants of the temporary parts have been successfully purged or converted to an approved part.
Attendees will learn best practices for using and managing temporary parts in a design process. Watch a live demonstration using a design data management system and learn how to prevent a temporary part from slipping through the release process and into manufacturing, all while you track and manage parts throughout the design cycle.
Date/Time
December 6, 2017 2 pm Eastern Time
Register
For more information or to register, click here.
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05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
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iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
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