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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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IPC Training Course on PCB Design for Embedded Components
June 3, 2022 | IPCEstimated reading time: Less than a minute
IPC will be holding a training course on PCB design for embedded components. The course will be held every Mondays and Wednesdays, 11:00 a.m. to 1:00 p.m., starting from August 6 until September 14, 2022.
The course will provide attendees the skills necessary to effectively implement designs requiring embedded components in accordance with product requirements. The class also focuses on PWB/PBA designs that require advanced or complex packaging, have reduced available board area, have reduced physical component count, and require improved signal integrity performance. Participants will also learn about the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation.
Taught by an IPC-certified industry expert with more than 25 years of experience in the field, the six-week program utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and team projects to facilitate mastery of the key concepts required to design boards containing embedded components.
For more information or to register, visit IPC’s website.
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The Drive Toward UHDI and Substrates
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