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Design007 Magazine's January 2024 Issue Released
January 9, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

Manufacturing Know-how
Our cover image for this month’s issue of Design007 Magazine is a great representation of the PCB development process where design, fabrication, and assembly are all intertwined. But designers, sitting at the front end of the entire development cycle, must have more than a passing understanding of the processes downstream from them. Some analysts estimate that 70% of the cost of the final board is determined during the design cycle. That’s a lot of responsibility.
So, this month, we asked our expert contributors to share their thoughts on the absolute “must-know” aspects of fab, assembly and test that all designers should understand. In the end, we’re all in this together.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Precision PCB Acquires Assets of Microplace
10/13/2025 | Precision Technologies Inc.Precision Technologies Inc., doing business as Precision PCB, a One-Stop PCB Fabrication and Assembly services company with 27 years of experience providing Quality, Reliability and Excellence in customer service, has acquired the assets of Microplace, Inc.
ZenaTech Advances Taiwan Facility to Commissioning for NDAA-Compliant Drone Component Production
10/08/2025 | Globe NewswireZenaTech, Inc., a business technology solution provider specializing in AI (Artificial Intelligence) drones, Drone as a Service (DaaS), Enterprise SaaS, and Quantum Computing solutions, announces that its Taipei, Taiwan-based Spider Vision Sensors (SVS) subsidiary has advanced to the commissioning phase and assembly line setup at its recently leased 16,000 square-foot drone components manufacturing facility.
Dymax's New 9773 Ruggedized Adhesive Meets NASA ASTM E595 Low Outgassing
10/07/2025 | DymaxDymax, a leading manufacturer of rapid and light-curing materials and equipment, is pleased to add 9773 ruggedizing and staking adhesive to its portfolio of materials designed for coating, protecting, and securing components on printed circuit boards in satellites, missiles, and space applications.
UST, Kaynes Semicon Partner to Set Up Rs 3,330 Crore Joint Venture for Semiconductor Manufacturing in India
09/30/2025 | PRNewswireUST, a leading AI and technology transformation solutions company, has announced a strategic investment in Kaynes Semicon, a prominent Indian semiconductor manufacturer.
Indium Expert to Present on Solder Paste Solutions at SMTA Empire Expo and Tech Forum
09/29/2025 | Indium CorporationIndium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation on solder paste best practices at the SMTA Empire Expo and Tech Forum, to be held October 1 in East Syracuse, New York.