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IPC’s Road to Reliability Webinar Series Covers New e-Mobility Technologies
August 28, 2024 | IPCEstimated reading time: 1 minute
Starting September 12, IPC’s Road to Reliability Webinar series will bring industry leaders together to discuss the hurdles in achieving reliability for new e-mobility technology. Speakers will examine reliability drivers, technology applications, and target lifecycles in each free webinar.
- On September 12, 10 am CDT, Habib Mustain, Hereaus, will discuss power electronic substrate types, requirements, and challenges for today's EV applications and will address essential topics related to the use of power substrates in power electronic applications with an emphasis on EVs. Stan Rak, SF Rak Company, will serve as webinar moderator. Learn more and register.
- On October 17, 10 am CDT, Brian O'Leary, Indium Corporation, will discuss the impact of the software defined vehicle on hardware design and manufacture. In addition, he will cover how automakers and system designers are addressing future features in their hardware design, the impact of these strategies on the manufacturing of these parts, how safety is rated and reliability targeted and tested. Learn more and register.
- And rounding out the series, on November 14 at 10 am CDT, Brenda Baney, BCubed Consulting, will serve as webinar moderator, guiding expert panelists Yusuf Williams, Harman Automotive Division; Bing Xu, iPoint-systems Gmbh; and Leanne Mallini, Analog Devices, in a discussion on what automakers, startups, and T1s are demanding from their supply chains in terms of sustainability. Panelists will weigh in the top three challenge areas beyond current regulatory reporting and what may be coming next and will touch on recycling, PFAS, carbon neutrality, and the changeover of electronics assembly reporting. Learn more and register.
“These free webinar sessions will allow participants to better understand technology gaps, broaden their professional connections, and uncover strategies for meeting reliability objectives,” said Tracy Riggan, IPC senior director, business development, Solutions. “IPC would like to thank all speakers and moderators for lending their expertise and especially to Indium Corporation for sponsoring the webinar series.”
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12/03/2024 | HyRelHyRel Technologies, a global provider of quick-turn semiconductor modification solutions, is proud to announce the sale of its first Versacell Robotic Solder Dip & BGA Reballing System to one of the top five defense contractors. Originally developed for internal use, the revolutionary Versacell System drew the attention of the contractor, who recognized its impressive precision, accuracy, and efficiency.
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DuPont to Feature Innovative Electronics Products and Solutions at Electronica 2024
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Absolute EMS Earns ITAR Registration
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Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.