Estimated reading time: 3 minutes

EPTE Newsletter from Japan: JPCA Show 2011, Part II

I'm not exaggerating when I say there were more than 1,000 new products and technologies presented at the JPCA Show 2011. Most of these products were connected to the consumer electronics market in some way--materials, equipment, circuit boards, designs, IC packaging, application or assembly. All of the electronics vendors that featured new products for the aforementioned segments concentrated on two consumer products: Smart phones and tablet PCs. Products associated with flat screen 3-D TVs were not as popular this year, but, depending on marketing, it could be an extremely hot item next year.

Apple has expanded from computers to consumer electronics over the past couple of decades. Sony's Walkman was the first portable music device; however, the iPod revolutionized the way we listen to music. Large electronics companies rolled out similar MP3 products as the iPod gained in popularity, but Apple still enjoys the highest market share. The iPhone was the trailblazer that changed the image of cellular phones. Its popularity continues to grow, and its profits contribute the largest percent of revenue for Apple. The iPad was the first tablet PC and did indeed create a new market. Sales continue to rise year-over-year, and competitive response was similar to the iPod. Most of the large PC manufacturers launched their own version of the iPad, but, again, Apple enjoys the lion's share of the market. The MacBook Air was inspired by the iPad. It is the thinnest and lightest portable PC in the market, but it is not very popular within the business community. It does have its niche with certain Apple customers--it is designed exclusively around Flash storage.

There's no question that Apple is on the cutting edge of consumer electronics. Along with their innovative products came an inspiration for new designs and technologies. New Apple products continue to change technology for PCBs and IC packaging. Many companies featured products associated with smart phones and tablet PCs. Multilayer board manufacturers showcased thinner HDI boards with new embedded components for the next generation of portable electronics, and flex circuit manufacturers displayed high-density rigid-flex products for smart phones and tablet PCs. Several industry experts were talking about new IC packaging technologies for mobile devices, such as Through Silicon Via Holes (TSV) and Through Mold Via Holes (TMV) of Package on Package (PoP). Substrate manufacturers had actual samples of build-up boards. A new trend with substrates is the use of coreless boards to reduce their thickness. Some manufacturers continue to have difficulties obtaining flatness with the substrates.

One of my business acquaintances from the packaging industry shared with me a very frustrating situation with Apple: Any extra business from the manufacture of Apple products hasn't trickled down to Japanese manufacturers. As a matter of fact, these manufacturers receive just a few crumbs from the plate. Apple employs EMS companies outside of Japan to assemble their products, and use non-Japanese subcontractors to manufacture their A4 and A5 semiconductors. All this business and hardly any of it benefits Japanese manufacturers. So, these manufacturers now promote their high-end products to domestic electronics companies. Unfortunately, these companies do not have Apple's market share.

Dominique K. NumakuraDKN Research, www.dknresearch.com

Headlines of the Week(Please contact haverhill@dknreseach.com for further information of the news.)

1. Tanaka Denshi Kogyo (Bonding wire supplier in Japan) 6/14The supplier has commercialized a new bonding wire made of silver.

2. Samsung Electronics (Major electronics company in Korea) 6/16The company has developed a new 3-D memory device with a graphen material built on large-sized flexible substrates.

3. Mitsubishi Heavy Industry (Major machinery company in Japan) 6/16The company has developed the industry's first large-sized, movable lithium ion secondary battery with 1,000kW capacity. The large system can be towed by tracks.

4. Panasonic (Major electronics company in Japan) 6/20The company has developed the world's first thermoelectric generator tube for geothermal power generation. A 10 cm long tube is capable of generating 1.3W.

5. Shinko Electric (Major substrate supplier in Japan) 6/20The supplier has begun the volume production of "DDR3,"a new coreless substrate developed for thin semiconductor packages. It will provide more freedom for package designs.

6. AIST (R&D organization in Japan) 6/21The organization has co-developed a new CIGS-based flexible photovoltaic cell with Fuji Film. The new device has a 15.0% conversion rate.

7. Elpida Memory (Major semiconductor manufacturer in Japan) 6/27The manufacturer has begun a sample supply of new DDR3 SDRAM devices. The new device has four chips assembled by a TSV technology.

8. Panasonic Electric (Major circuit board material supplier in Japan) 6/22The supplier has proposed the introduction of 3-D mold circuit technology for medical use capsule cameras. The technology will reduce the size of the devices.

9. Mitsumi (Major device manufacturers in Japan) 6/24The manufacturer has unveiled a new sensor for a digital blood pressure monitor. The new device is also capable of measuring the softness of the blood vessels.